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74HC08N,652

NXP Semiconductors

74HC08N,652 by NXP Semiconductors

74HC08N,652 by NXP Semiconductors is a CMOS Logic Gate with 4 functions and 2 inputs. It has a propagation delay of 27 ns at 5V supply voltage. Widely used in automotive applications due to its high operating temperature range of -40°C to 125°C.

Median Price

$0.619

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26,755 parts In-Stock

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-

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$0.619

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$0.513

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$0.458

26,755

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$0.619

$0.513

$0.458

Distributors (In-Stock)

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Digiode

USA . 3,629 parts In-Stock

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$0.247

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Vyrian

USA . 7,423 parts In-Stock

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Anansix

USA . 1,657 parts In-Stock

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Cogito LLC

Ukraine . 1,392 parts In-Stock

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Connector Distribution Corp

USA . 25 parts In-Stock

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Right Parts Inc.

USA . 25 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 26,318 parts In-Stock

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$0.221

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Corphita

USA . 1,845 parts In-Stock

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$0.234

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Native Components

USA . 752 parts In-Stock

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$1.870

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$1.870

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Northwest PG Solutions

USA . 306 parts In-Stock

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$2.057

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Microchip USA

USA . 359 parts In-Stock

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$2.800

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$2.800

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$2.800

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$2.800

359

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$2.800

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$2.800

AZTECH Wire

Italy . 721 parts In-Stock

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$15.750

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Perfect Parts

USA . 1,617 parts In-Stock

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UNI Independent Distributors

Spain . 1,450 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the 74HC08N,652 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors provides high-quality logic gates that offer reliability and performance. With a wide range of applications, this product is perfect for designing circuits in automotive systems, consumer electronics, and more. Trust in NXP Semiconductors to deliver value and innovation with every component, ensuring your projects run smoothly and efficiently. Elevate your designs with the 74HC08N,652 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for a variety of applications.

Propagation Delay At Nominal Supply: 27 ns

With a fast propagation delay of 27 ns, this logic gate ensures quick response times in processing signals.

No. of Functions: 4

Having 4 functions in one component provides versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V, this logic gate can easily integrate into existing systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this logic gate can withstand harsh environmental conditions.

Technical Specifications

Logic Gates 74HC08N,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HC08N,652 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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