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74AVCH16T245BX,518

NXP Semiconductors

74AVCH16T245BX,518 by NXP Semiconductors

74AVCH16T245BX,518 by NXP is a bidirectional bus driver with a propagation delay of just 10.2 ns and operates at 0.8/3.3V levels. It features a compact no-lead package suitable for automotive applications, supporting up to 6A output current. With a temperature range from -40 °C to 125 °C, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 79,000 parts In-Stock

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Anansix

USA . 2,824 parts In-Stock

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Vyrian

USA . 2,481 parts In-Stock

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Digiode

USA . 1,312 parts In-Stock

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Native Components

USA . 743 parts In-Stock

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$0.799

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Northwest PG Solutions

USA . 2,368 parts In-Stock

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$0.879

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Andel Nordic

Denmark . 5,654 parts In-Stock

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$1.236

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AZTECH Wire

Italy . 484 parts In-Stock

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$19.860

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One Stop Electronics

USA . 1,471 parts In-Stock

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$36.000

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Component Stockers USA

USA . 683 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,720 parts In-Stock

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Microchip USA

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UNI Independent Distributors

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Corphita

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Overview

Elevate your designs with the 74AVCH16T245BX,518 from NXP Semiconductors—a trusted leader in innovation. This versatile bus driver and transceiver enhances signal integrity while offering exceptional speed and reliability, making it perfect for automotive applications. Designed for seamless performance across varied environments, its compact form ensures easy integration without compromising power efficiency. Choose quality and performance; choose NXP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resilience, making it suitable for various applications.

Propagation Delay At Nominal Supply: 10.2 ns

A low propagation delay enhances the product's performance, allowing for faster signal transmission and higher efficiency.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it ideal for modern devices.

No. of Functions: 2

With multiple functions, this product provides versatility, enabling it to serve different roles in a circuit.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization and better alignment on circuit boards.

No. of Bits: 8

The 8-bit capability is suitable for a wide range of applications, ensuring adequate data handling.

Translation: 0.8/3.3V & 0.8/3.3V

Supports dual voltage levels, making it flexible for various digital systems and enhancing compatibility.

Load Capacitance (CL): 15 pF

A low load capacitance allows for quicker signal response times, improving overall circuit performance.

Power Supplies (V): 1.2/3.3

Flexible power supply options facilitate integration into different systems, accommodating various power requirements.

No. of Terminals: 60

A higher number of terminals enables more connections, enhancing circuit complexity and functionality.

Package Style (Meter): GRID ARRAY

Grid array packaging offers improved thermal performance and power handling capabilities.

Maximum I(ol): 6 Amp

The ability to handle up to 6 Amps makes this product suitable for high-current applications, ensuring reliability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability under extreme conditions, making it suitable for automotive applications.

Output Characteristics: 3-STATE

3-state output capability allows for increased flexibility in communication, making it ideal for multi-device systems.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature guarantees performance in cold environments, enhancing reliability.

Terminal Position: BOTTOM

Bottom terminal positions facilitate effective heat dissipation and improve PCB layout efficiency.

Output Polarity: TRUE

True output polarity enhances signal integrity, ensuring accurate data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature allows for proper soldering without compromising component integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports compatibility with modern soldering processes.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this component meets stringent reliability standards required in vehicles.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making it suitable for energy-efficient systems.

Terminal Form: NO LEAD

No lead terminal form contributes to smaller footprints and enhanced reliability by reducing the risk of lead-related issues.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for compact designs on PCBs, enabling more functionalities in less space.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability increases flexibility, allowing for various data communication setups.

Control Type: COMMON CONTROL

Common control type simplifies operation and integration into existing systems, ensuring ease of use.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate moisture sensitivity, providing adequate protection for the component in typical storage conditions.

Technical Specifications

Bus Driver & Transceivers 74AVCH16T245BX,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-PBGA-N60

Load Capacitance (CL):

15 pF

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

60

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA60,8X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

10.2 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

0.8/3.3V&0.8/3.3V

Trade Compliance

74AVCH16T245BX,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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