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74ALVT16245DGG,118

NXP Semiconductors

74ALVT16245DGG,118 by NXP Semiconductors

74ALVT16245DGG,118 by NXP Semiconductors is a dual 8-bit bus driver with a propagation delay of just 3.5 ns. It operates within a supply voltage range of 2.3V to 2.7V and supports industrial temperature grades from -40 °C to 85 °C. Ideal for high-speed data transmission in compact electronic designs, it features a plastic/epoxy package and surface mount design.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 4,176 parts In-Stock

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Anansix

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Native Components

USA . 845 parts In-Stock

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Northwest PG Solutions

USA . 208 parts In-Stock

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AZTECH Wire

Italy . 273 parts In-Stock

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One Stop Electronics

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Microchip USA

USA . 340 parts In-Stock

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UNI Independent Distributors

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Corphita

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Perfect Parts

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Andel Nordic

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Overview

Unlock unparalleled performance with the 74ALVT16245DGG,118 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP offers this advanced bus driver and transceiver solution that excels in industrial applications. With its robust design and outstanding efficiency, it ensures reliable data transfer while handling varying environmental conditions. Elevate your projects with a product that combines durability, speed, and versatility—transforming your designs into cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides good durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space on PCBs, making this product ideal for compact designs.

No. of Functions: 2

Dual function capability enhances versatility, allowing for multiple configurations in a single chip, which can reduce overall system complexity.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient layout on a PCB, optimizing space and enabling higher density designs.

No. of Bits: 8

With 8 bits, this product facilitates high data throughput, making it suitable for applications that require robust data handling.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal supply voltage of 2.5 V is energy-efficient, making this product suitable for battery-powered and low-power applications.

No. of Terminals: 48

A higher number of terminals allows for greater connectivity options, enabling more extensive integration in complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for high-density mounting, saving space and enabling design of more compact electronic solutions.

Propagation Delay (tpd): 3.5 ns

A short propagation delay of 3.5 ns ensures fast signal transmission, enhancing the overall performance of high-speed applications.

Maximum Operating Temperature: 85 C

A high maximum operating temperature of 85 °C indicates robustness, allowing this product to function reliably in demanding environments.

Output Characteristics: 3-STATE

3-state output characteristic enables efficient bus management and design flexibility in multi-device communications.

Minimum Operating Temperature: -40 C

A wide operating temperature range from -40 °C makes this product suitable for industrial applications in harsh environments.

Terminal Position: DUAL

The dual terminal position design enhances PCB layout flexibility, allowing designers more choices in routing and connectivity.

No. of Ports: 2

Having two ports allows for simultaneous communication channels, which is beneficial for applications requiring parallel processing.

Output Polarity: TRUE

True output polarity simplifies design integration and can reduce the need for additional inversion stages in circuitry.

Minimum Supply Voltage (Vsup): 2.3 V

A minimum supply voltage of 2.3 V allows compatibility with a broad range of power sources, providing design flexibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grading signifies reliability in extreme conditions, ensuring longevity and consistent performance in critical applications.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS transistors, offering high speed and low power consumption, ideal for versatile applications.

Terminal Form: GULL WING

Gull-wing terminal form ensures excellent soldering quality and reliability, contributing to better performance in final product assembly.

Maximum Supply Voltage (Vsup): 2.7 V

With a maximum supply voltage of 2.7 V, this product is suitable for modern low-voltage applications, promoting energy efficiency.

Technical Specifications

Bus Driver & Transceivers 74ALVT16245DGG,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL; CAN ALSO OPERATE AT 3.3V VCC

Family:

ALVT

JESD-30 Code:

R-PDSO-G48

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

3.5 ns

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

74ALVT16245DGG,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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