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74AHC377PW,112

NXP Semiconductors

74AHC377PW,112 by NXP Semiconductors

NXP Semiconductors' 74AHC377PW,112 is an 8-bit latch with a propagation delay of 13.5 ns at 5V. It operates b/w -40 to 125°C, suitable for automotive applications. With a max frequency of 75 MHz, it features a GULL WING terminal form and is surface mountable.

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Lifecycle Status

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 13,529 parts In-Stock

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Corohmni

South Africa . 47 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Continental Prestige Electronics

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Overview

Unlocking endless possibilities in digital circuits, the NXP Semiconductors 74AHC377PW,112 Latch & Flip-Flop offers unparalleled speed and reliability. Designed with cutting-edge technology, this product ensures seamless operation in automotive applications, guaranteeing exceptional performance even in extreme temperatures. With a compact design and low power consumption, this versatile component is the perfect choice for high-speed data storage and processing, making it an essential tool for engineers looking to elevate their designs to new heights. Experience the NXP advantage today and revolutionize your electronic projects with the 74AHC377PW,112.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer durability and protection for the internal components of the latch or flip-flop, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 13.5 ns

Low propagation delay ensures fast response times, making this latch or flip-flop suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure PCB mounting, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape offers a compact design, making it suitable for applications with limited space constraints.

No. of Bits: 8

8-bit capacity provides flexibility and versatility in storing and manipulating data in digital systems.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage ensures compatibility with common digital systems and power sources.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and proper operation in various circuit configurations.

Power Supplies (V): 2/5.5

Wide power supply range allows for operation in different voltage environments, enhancing flexibility and compatibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and thin profile with a shrink pitch design offers space-saving benefits and ease of integration in densely populated PCBs.

Maximum I (ol): 8 Amp

High output current capability enables driving of external loads with ease, expanding the range of applications for the latch or flip-flop.

Propagation Delay (tpd): 20 ns

Fast propagation delay ensures quick signal processing and response times, making the product suitable for real-time applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability and performance in harsh environmental conditions, such as automotive applications.

Output Characteristics: 3-STATE

3-state output allows for the device to be tristated, providing flexibility in controlling the output and reducing power consumption when not in use.

Trigger Type: POSITIVE EDGE

Positive edge trigger simplifies timing and synchronization requirements in digital systems, ensuring accurate operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables reliable performance even in cold environments, enhancing the product's versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures good contact reliability and corrosion resistance for long-term functionality.

Terminal Position: DUAL

Dual terminal positioning enhances PCB mounting stability and ease of soldering, ensuring secure and reliable connections.

Maximum Seated Height: 1.1 mm

Low seated height facilitates compact PCB designs and minimizes overall system height, making it suitable for space-constrained applications.

Width: 4.4 mm

Narrow width allows for efficient use of PCB space and enables compact system designs.

Output Polarity: TRUE

True output polarity simplifies signal interpretation and ensures compatibility with common digital logic standards.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage enables operation in low-power scenarios and extends battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time at peak temperature allows for reliable soldering and assembly, ensuring robust connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures compatibility with lead-free soldering processes, meeting modern manufacturing standards.

Length: 6.5 mm

Compact length contributes to space-saving PCB layouts and efficient system integration.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive environments with varying temperature conditions.

Maximum Frequency At Nominal Supply: 75000000 Hz

High maximum operating frequency allows for rapid signal processing and efficient performance in high-speed digital systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and versatile digital signal processing capabilities, making it suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mounting and rework processes, ensuring secure solder joints and reliable connections.

Packing Method: TUBE

Tube packing method facilitates storage, handling, and shipping of the product, providing protection and organization.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density PCB layouts and compact system designs, enabling efficient use of available space.

Minimum fmax: 110 MHz

High minimum operating frequency capability ensures fast signal processing and reliable performance in demanding digital applications.

Maximum Supply Voltage (Vsup): 5.5 V

Extended maximum supply voltage range offers compatibility with higher voltage systems and enhanced robustness against voltage fluctuations.

Technical Specifications

Latches & Flip-Flops 74AHC377PW,112 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

AHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

110 MHz

Trade Compliance

74AHC377PW,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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