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5962-8987501CX

NXP Semiconductors

5962-8987501CX by NXP Semiconductors

ANALOG MULTIPLE FUNCTIONS; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

5962-8987501CX by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,508 parts In-Stock

1+ parts

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1k+ parts

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1,508

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Anansix

USA . 1,287 parts In-Stock

1+ parts

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1,287

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Vyrian

USA . 1,250 parts In-Stock

1+ parts

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1,250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 658 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

-

10k+ parts

$0.137

658

$0.142

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-

$0.137

Northwest PG Solutions

USA . 924 parts In-Stock

1+ parts

$0.157

100+ parts

-

1k+ parts

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$0.138

924

$0.157

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$0.138

One Stop Electronics

USA . 1,307 parts In-Stock

1+ parts

$0.500

100+ parts

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1,307

$0.500

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Corphita

USA . 370 parts In-Stock

1+ parts

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370

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UNI Independent Distributors

Spain . 125 parts In-Stock

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125

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Technical Specifications

Analog Computational 5962-8987501CX attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-CDIP-T14

Nominal Negative Supply Voltage (Vsup):

-15 V

Maximum Negative Input Voltage:

-11.5 V

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Positive Input Voltage:

11.5 V

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Nominal Supply Voltage (Vsup):

32 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

5962-8987501CX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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