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MUSES72320V-TE1

Nisshinbo Micro Devices

MUSES72320V-TE1 by Nisshinbo Micro Devices

VOLUME CONTROL CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Audio Control ICs MUSES72320V-TE1 attributes and parameters. Explore more Audio Control ICs devices from Nisshinbo Micro Devices

Specs

Channel Separation:

120 dB

General IC Type:

Harmonic Distortion:

.001 %

JESD-30 Code:

R-PDSO-G32

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

+-15

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

MUSES72320V-TE1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Nisshinbo Micro Devices

New Japan Radio Co., Ltd. and Ricoh Electronic Devices Co., Ltd. of the Nisshinbo Group were integrated and started operation as Nisshinbo Micro Devices Inc. in January 2022. We will integrate the strengths of both companies and refine our "Connect Everything" technology, and, therefore, strive for further growth and development as an "Analog Solution Provider toward the realization of an ultra-smart society. We will respond to customer needs with a diverse lineup of environmentally friendly products, including standard products such as Power Management ICs, Operational Amplifiers and Li-ion Battery Protection ICs in which we have an extensive track record, and high-performance LSIs such as PMICs and Signal Processing ICs, as well as component products using microwave technology that we have cultivated over many years. We will also continue to build and maintain close partnerships with our customers and partner companies, and make every effort so as to further develop and contribute to the industry.

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