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551-10-155-16-003003

Mill-max Mfg

551-10-155-16-003003 by Mill-max Mfg

IC SOCKET; Device Type Used On: PGA155; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; Additional Features: PGA SOCKET;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Chip Carrier IC & Component Sockets 551-10-155-16-003003 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg

Connectivity

Number of Positions or Pins:

155

Contact Finish - Mating:

Gold (10) over Nickel (150)

Contact Finish - Termination:

Gold with Nickel Barrier

Physical Characteristics

IC Socket Type:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

PGA Socket

Trade Compliance

551-10-155-16-003003 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.90.40.00

SB

8536.90.40.00

Manufacturer Highlights

Mill-max Mfg

Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.

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