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370-10-107-00-001100

Mill-max Mfg

370-10-107-00-001100 by Mill-max Mfg

IC SOCKET; Device Type Used On: SIP7; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); JESD-609 Code: e4;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Chip Carrier IC & Component Sockets 370-10-107-00-001100 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg

Connectivity

Number of Positions or Pins:

7

Contact Finish - Mating:

Gold (10) over Nickel (150)

Contact Finish - Termination:

Gold with Nickel Barrier

Contact Configuration:

Rectangle

Physical Characteristics

IC Socket Type:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

SIP Header

Trade Compliance

370-10-107-00-001100 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.90.40.00

SB

8536.90.40.00

Manufacturer Highlights

Mill-max Mfg

Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.

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