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214-99-318-01-670799

Mill-max Mfg

214-99-318-01-670799 by Mill-max Mfg

IC SOCKET; Device Type Used On: DIP18; Housing Material: NYLON46; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb); Additional Features: DIP SOCKET;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Chip Carrier IC & Component Sockets 214-99-318-01-670799 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg

Connectivity

Number of Positions or Pins:

18

Contact Finish - Mating:

TIN LEAD (100)

Contact Finish - Termination:

Tin / Lead

Contact Material:

Beryllium Copper

Contact Configuration:

Rectangle

Physical Characteristics

IC Socket Type:

Housing Material:

JESD-609 Code:

e0

Compatibility

Compatible Device Type:

Additional Features

Special Features:

DIP Socket

Trade Compliance

214-99-318-01-670799 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.90.40.00

SB

8536.90.40.00

Manufacturer Highlights

Mill-max Mfg

Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.

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