Loading...

USB5926C/KD

Microchip Technology

USB5926C/KD by Microchip Technology

USB5926C/KD by Microchip Technology is a BUS CONTROLLER IC with 100 terminals in a SQUARE package. It operates at 0-70 °C, supporting data transfer rates up to 625 MBps. Ideal for I2C, SMBUS, SPI, UART, and USB bus compatibility applications.

Median Price

$8.652

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$8.652

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$8.652

-

-

-

Vyrian

USA . 7,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,083

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 50 parts In-Stock

1+ parts

$8.652

100+ parts

$8.479

1k+ parts

$8.219

10k+ parts

$8.046

50

$8.652

$8.479

$8.219

$8.046

Vigor

Singapore . 299 parts In-Stock

1+ parts

$8.680

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$8.680

-

-

-

Corohmni

South Africa . 5,111 parts In-Stock

1+ parts

$18.145

100+ parts

-

1k+ parts

-

10k+ parts

-

5,111

$18.145

-

-

-

West Coast Incorporated

USA . 5,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,036

-

-

-

-

Overview

Experience seamless connectivity with the USB5926C/KD by Microchip Technology, a high-quality bus controller perfect for a wide range of applications. This versatile chip boasts superior performance and reliability, making it an essential component for your projects. Whether you're looking to streamline data transfer or enhance communication within your system, this innovative product offers unmatched value and benefits. Trust in Microchip Technology's reputation for excellence and elevate your designs with the USB5926C/KD today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that can withstand frequent use in various environments.

Surface Mount: YES

Easy to install and saves space on the circuit board.

Maximum Supply Voltage: 1.32 V

Can handle high supply voltages for reliable performance.

Package Shape: SQUARE

Compact shape that fits well in tight spaces on the circuit board.

No. of Terminals: 100

Sufficient number of terminals for connecting to other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles to suit different mounting and cooling requirements.

Minimum Supply Voltage: 1.08 V

Can operate effectively with low supply voltages, conserving energy.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures for extended use.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate for quick and efficient communication within the system.

Minimum Operating Temperature: 0 °C

Operational at low temperatures, suitable for various environments.

Terminal Position: QUAD

Quad terminal position for stable connections and ease of installation.

Maximum Seated Height: 0.9 mm

Low profile design for space-saving on the circuit board.

Width: 12 mm

Compact width for fitting into narrow spaces.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast data processing and communication.

Length: 12 mm

Compact length for efficient use of space on the circuit board.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Versatile bus controller compatible with various bus types for flexible connectivity.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly design.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent performance.

Bus Compatibility: I2C; SMBUS; SPI; UART; USB

Supports a wide range of bus types for universal compatibility with various devices.

Terminal Pitch: 0.4 mm

Fine terminal pitch for precise connections and space-saving on the circuit board.

Technical Specifications

Bus Controllers USB5926C/KD attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

also available with 3.3v supply

Bus Compatibility:

I2C; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-PQCC-N100

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC100,.47SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

USB5926C/KD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20