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UPD350A/Q8X

Microchip Technology

UPD350A/Q8X by Microchip Technology

UPD350A/Q8X by Microchip Tech is a bus controller with 28 terminals, operating at 1.62-1.98V, and clock frequency up to 48MHz. It supports I2C, SMBUS, SPI, USB buses for data transfer at 0.125MBps. Ideal for applications requiring low-profile design and commercial temperature grade operation.

Median Price

$1.730

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 4,900 parts In-Stock

1+ parts

$1.730

100+ parts

$1.320

1k+ parts

$1.210

10k+ parts

$1.160

4,900

$1.730

$1.320

$1.210

$1.160

Mouser Electronics

USA . 1,260 parts In-Stock

1+ parts

$1.730

100+ parts

$1.450

1k+ parts

$1.380

10k+ parts

-

1,260

$1.730

$1.450

$1.380

-

DigiKey

USA . 331 parts In-Stock

1+ parts

$1.730

100+ parts

$1.320

1k+ parts

-

10k+ parts

-

331

$1.730

$1.320

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NexGen Digital

USA . 431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

431

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 63 parts In-Stock

1+ parts

$38.804

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$38.804

-

-

-

West Coast Incorporated

USA . 4,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,885

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Lixinc

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

440

-

-

-

-

Overview

Discover the UPD350A/Q8X by Microchip Technology, a high-quality Bus Controller designed to streamline data transfer in various applications. With a maximum clock frequency of 48 MHz and compatibility with I2C, SMBUS, SPI, and USB buses, this product offers exceptional performance and versatility. Its compact square package, low supply voltage, and commercial temperature grade make it ideal for a wide range of projects. Trust in the reliability and innovation of Microchip Technology to enhance your system with the UPD350A/Q8X.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.98 V

Suitable for a wide range of power supply configurations, providing flexibility in system design.

Package Shape: SQUARE

Optimal shape for efficient placement on the PCB, maximizing space utilization.

No. of Terminals: 28

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal performance, allows for efficient heat dissipation, and enables compact designs.

Minimum Supply Voltage: 1.62 V

Ensures compatibility with lower voltage supply systems, increasing versatility.

Maximum Operating Temperature: 70 °C

Allows for reliable operation in high-temperature environments, ensuring optimal performance.

Maximum Data Transfer Rate: 0.125 MBps

Enables efficient data communication, supporting high-speed data transfer requirements.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports various bus protocols, making it versatile for different applications.

Technical Specifications

Bus Controllers UPD350A/Q8X attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C; SMBUS; SPI; USB

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

.125 MBps

JESD-30 Code:

S-PQCC-N28

Length:

4 mm

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

UPD350A/Q8X Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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