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UPD1002-A/MQ

Microchip Technology

UPD1002-A/MQ by Microchip Technology

UPD1002-A/MQ by Microchip: 32-terminal BUS CONTROLLER with CMOS tech. Operates at -40 to 70°C, supports SMBUS, SPI, VBUS. Ideal for commercial applications requiring a surface-mount package with a max supply voltage of 5.3V.

Median Price

$0.996

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 490 parts In-Stock

1+ parts

$0.282

100+ parts

$0.282

1k+ parts

$0.282

10k+ parts

$0.282

490

$0.282

$0.282

$0.282

$0.282

DigiKey

USA . 353 parts In-Stock

1+ parts

$1.710

100+ parts

$1.300

1k+ parts

-

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353

$1.710

$1.300

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Verical

USA . 490 parts In-Stock

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490

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$0.780

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650

$0.780

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Bristol Electronics

USA . 1,259 parts In-Stock

1+ parts

$2.371

100+ parts

$1.115

1k+ parts

$1.020

10k+ parts

-

1,259

$2.371

$1.115

$1.020

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Vyrian

USA . 8,352 parts In-Stock

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Dan-Mar Components

USA . 1,259 parts In-Stock

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1,259

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Distributors (Availability)

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Ampacity Inc.

Singapore . 97 parts In-Stock

1+ parts

$0.240

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97

$0.240

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

$0.741

10k+ parts

$0.726

100

$0.780

-

$0.741

$0.726

Vigor

Singapore . 353 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

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353

$1.710

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Corohmni

South Africa . 195 parts In-Stock

1+ parts

$29.101

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195

$29.101

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RGB Technical Solutions

Ukraine . 4,211 parts In-Stock

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Overview

Experience seamless communication and efficient data transfer with the UPD1002-A/MQ by Microchip Technology, a leading manufacturer known for superior quality and reliability. As a versatile Bus Controller, this product offers a wide range of applications in various industries. With advanced features and a compact design, customers can expect enhanced performance and streamlined operations. Trust Microchip Technology to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.3 V

Ability to handle a high maximum supply voltage ensures compatibility with a wide range of electronic systems.

Screening Level: TS 16949

Compliance with TS 16949 screening level ensures high quality and reliability in automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards, making it suitable for compact designs.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with various components and devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures effective heat dissipation and compact form factor.

Minimum Supply Voltage: 3.1 V

Low minimum supply voltage requirement makes the product suitable for power-sensitive applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance in demanding environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance.

Terminal Position: QUAD

Quad terminal position arrangement facilitates easy connection and routing of signals.

Maximum Seated Height: 1 mm

Low maximum seated height minimizes the overall profile of the package, suitable for space-constrained designs.

Width: 5 mm

Compact 5 mm width allows for efficient board layout and component placement.

Length: 5 mm

Square package with a length of 5 mm provides a balanced form factor for various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Peripheral IC type of bus controller for Universal Serial Bus ensures smooth and efficient communication between devices.

Technology: CMOS

CMOS technology offers low power consumption and compatibility with various digital systems.

Terminal Form: NO LEAD

No lead terminal form simplifies the assembly process and reduces the risk of solder joint failure.

Bus Compatibility: SMBUS; SPI; VBUS

Compatibility with SMBus, SPI, and VBus interfaces provides flexibility for integration into different communication protocols.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting and precise signal routing on the circuit board.

Technical Specifications

Bus Controllers UPD1002-A/MQ attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Bus Compatibility:

SMBUS; SPI; VBUS

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.3 V

Minimum Supply Voltage:

3.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

UPD1002-A/MQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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