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TCM809LVLB713

Microchip Technology

TCM809LVLB713 by Microchip Technology

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$0.047

100+ parts

-

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-

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3

$0.047

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Microchip Technology

USA . 39,000 parts In-Stock

1+ parts

$0.460

100+ parts

$0.350

1k+ parts

$0.300

10k+ parts

$0.260

39,000

$0.460

$0.350

$0.300

$0.260

DigiKey

USA . 1,658 parts In-Stock

1+ parts

$0.460

100+ parts

$0.350

1k+ parts

-

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$0.350

1,658

$0.460

$0.350

-

$0.350

Mouser Electronics

USA . 410 parts In-Stock

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$0.460

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$0.350

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410

$0.460

$0.350

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Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$8.290

100+ parts

$7.544

1k+ parts

$6.798

10k+ parts

-

500

$8.290

$7.544

$6.798

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Verical

USA . 260 parts In-Stock

1+ parts

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$0.146

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$0.146

260

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$0.146

Chip1Stop

Japan . 5 parts In-Stock

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NAC Semi

USA . 33,000 parts In-Stock

1+ parts

$0.280

100+ parts

$0.250

1k+ parts

$0.220

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-

33,000

$0.280

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,271 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

$0.980

10k+ parts

$0.980

3,271

$1.400

-

$0.980

$0.980

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$8.290

100+ parts

$7.544

1k+ parts

$6.798

10k+ parts

-

500

$8.290

$7.544

$6.798

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QUARKTWIN TECHNOLOGY LTD

USA . 18,624 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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West Coast Incorporated

USA . 7,042 parts In-Stock

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7,042

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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GreenTree Electronics

Israel . 1,450 parts In-Stock

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1,450

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Perfect Parts

USA . 1,217 parts In-Stock

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1,217

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Technical Specifications

Power Management ICs TCM809LVLB713 attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.025 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.03 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.25 mm

Trade Compliance

TCM809LVLB713 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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