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TC4427EOA723

Microchip Technology

TC4427EOA723 by Microchip Technology

TC4427EOA723 by Microchip Technology is a MOSFET Gate Driver with 2 functions, CMOS technology, and 1.5A peak current limit. It operates b/w -40 to 85°C and has turn-on/off times of 0.04/0.06 µs respectively. Ideal for industrial applications requiring precise control over MOSFET switching.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 844 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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844

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Nova Conductors

Japan . 40 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,633 parts In-Stock

1+ parts

$7.833

100+ parts

-

1k+ parts

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10k+ parts

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2,633

$7.833

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Corohmni

South Africa . 180 parts In-Stock

1+ parts

$10.918

100+ parts

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180

$10.918

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Semicontronic

India . 704 parts In-Stock

1+ parts

$12.500

100+ parts

$12.188

1k+ parts

$12.125

10k+ parts

-

704

$12.500

$12.188

$12.125

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AZTECH Wire

Italy . 777 parts In-Stock

1+ parts

$17.435

100+ parts

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10k+ parts

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777

$17.435

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Fulton Briggs Corp.

USA . 7,115 parts In-Stock

1+ parts

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7,115

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Continental Prestige Electronics

USA . 4,945 parts In-Stock

1+ parts

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4,945

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Argo Parts USA

USA . 4,929 parts In-Stock

1+ parts

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4,929

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unleash the power of your electronics with the TC4427EOA723 by Microchip Technology. This high-quality MOSFET gate driver offers unmatched reliability and performance, making it the perfect choice for a wide range of applications. With its advanced technology and industrial-grade temperature grade, this small outline package delivers fast turn-on and turn-off times, ensuring optimal efficiency and precision in every use. Trust Microchip Technology to provide innovative solutions that elevate your projects to new heights. Elevate your electronics with the TC4427EOA723 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Being surface mountable allows for convenient and efficient assembly on a PCB, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device simplifies circuit design and can save on component costs.

Package Shape: RECTANGULAR

The rectangular shape provides easy placement and orientation on the PCB, aiding in assembly and reducing errors.

No. of Terminals: 8

Having multiple terminals allows for greater connectivity options and flexibility in circuit design.

Package Style: SMALL OUTLINE

The small outline package style saves space on the PCB and enables high-density mounting, ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the device can withstand demanding industrial conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliability in extreme environments, making it suitable for a variety of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, enhancing the product's reliability and lifespan.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and enable easy connection to external components.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact build and easy integration into tight spaces, making it suitable for miniaturized designs.

Width: 3.9 mm

The narrow width of the device saves PCB real estate, enabling efficient use of space in tight layouts.

Length: 4.9 mm

The compact length of the device facilitates space-saving design solutions and allows for versatile placement on the PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the product meets the stringent requirements of harsh operating environments, ensuring reliable performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an efficient choice for various applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure PCB mounting and ease of soldering, ensuring a reliable connection for optimal performance.

Turn-on Time: 0.04 us

The fast turn-on time ensures quick response and precise control of the MOSFET, enhancing overall system efficiency and performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with widespread PCB designs and facilitates easy integration into existing circuit layouts.

Nominal Output Peak Current Limit: 1.5 A

With a high nominal output peak current limit, the device can handle demanding loads and provide reliable operation in various applications.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based interface IC type offers flexibility in driving MOSFETs, enabling versatility in circuit design and ensuring compatibility with different control systems.

Turn-off Time: 0.06 us

The fast turn-off time enhances switching speed and efficiency, minimizing power losses and improving overall performance of the MOSFET driver.

Technical Specifications

MOSFET Gate Drivers TC4427EOA723 attributes and parameters. Explore more MOSFET Gate Drivers devices from Microchip Technology

Specs

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.06 us

Turn-on Time:

.04 us

Width:

3.9 mm

Trade Compliance

TC4427EOA723 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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