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SY87701ALHG-TR

Microchip Technology

SY87701ALHG-TR by Microchip Technology

SY87701ALHG-TR by Microchip is an ATM/SONET/SDH clock recovery circuit with 32 terminals in a square flatpack package. Operating temperature range from -40 to 85°C, suitable for industrial applications like ATM, SDH, and SONET. It has a nominal voltage of 3.3V and max supply current of 160mA.

Median Price

$43.910

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,000 parts In-Stock

1+ parts

$43.910

100+ parts

$33.260

1k+ parts

$32.140

10k+ parts

$31.780

2,000

$43.910

$33.260

$32.140

$31.780

DigiKey

USA . 1,785 parts In-Stock

1+ parts

$43.910

100+ parts

$33.260

1k+ parts

$33.260

10k+ parts

-

1,785

$43.910

$33.260

$33.260

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$32.140

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$32.140

-

-

-

NAC Semi

USA . 2,000 parts In-Stock

1+ parts

$40.400

100+ parts

$37.210

1k+ parts

$34.490

10k+ parts

-

2,000

$40.400

$37.210

$34.490

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Vyrian

USA . 3,993 parts In-Stock

1+ parts

-

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1k+ parts

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3,993

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 842 parts In-Stock

1+ parts

$10.220

100+ parts

-

1k+ parts

-

10k+ parts

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842

$10.220

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$32.140

100+ parts

$30.533

1k+ parts

-

10k+ parts

$28.605

300

$32.140

$30.533

-

$28.605

Ampacity Inc.

Singapore . 377 parts In-Stock

1+ parts

$37.320

100+ parts

-

1k+ parts

-

10k+ parts

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377

$37.320

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Component Stockers USA

USA . 2,956 parts In-Stock

1+ parts

$43.370

100+ parts

$32.850

1k+ parts

$32.850

10k+ parts

-

2,956

$43.370

$32.850

$32.850

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Marpe Global Electronics

Taiwan . 6,894 parts In-Stock

1+ parts

-

100+ parts

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6,894

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QualityLine Systems

Poland . 6,894 parts In-Stock

1+ parts

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6,894

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XL Components Corporation

Australia . 6,894 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,894

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Upgrade your telecom system with the cutting-edge SY87701ALHG-TR by Microchip Technology. With a reputation for top-notch quality and reliability, Microchip delivers another exceptional product in the ATM/SONET/SDH Circuits category. This versatile component is perfect for ATM, SDH, and SONET applications, providing unmatched performance and efficiency. Trust in Microchip's expertise and elevate your telecom solutions with the SY87701ALHG-TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the circuit, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it ideal for compact applications.

Package Shape: SQUARE

The square shape of the package provides a uniform and stable mounting option, ensuring secure placement in various devices.

No. of Terminals: 32

With 32 terminals, this circuit offers versatile connectivity options for integration into different systems and configurations.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE

This package style offers a combination of heat dissipation, compact size, and easy installation, making it suitable for various environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in demanding conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments, ensuring consistent functionality.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance, ensuring long-term reliability and stable performance.

Terminal Position: QUAD

The quad terminal position allows for secure connections and stable signal transmission, making it a dependable choice for telecommunications applications.

Maximum Seated Height: 1.2 mm

With a low maximum seated height, this circuit can be easily integrated into compact devices without compromising on performance.

Width: 7 mm

The 7mm width offers a compact form factor, making it suitable for space-constrained applications where size matters.

Length: 7 mm

The 7mm length provides a balanced size for easy integration into a wide range of devices without sacrificing functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environments, making it a durable choice for demanding applications.

Applications: ATM; SDH; SONET

This circuit is designed for use in ATM, SDH, and SONET systems, providing compatibility with a range of telecommunications technologies.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and easy soldering for efficient and reliable installation.

Maximum Supply Current: 160 mA

With a maximum supply current of 160mA, this circuit can handle power requirements effectively, ensuring consistent and stable operation.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

This circuit is specifically designed for clock recovery in ATM, SONET, and SDH systems, offering precise timing synchronization for reliable telecommunications performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides optimal power efficiency and performance, making it an energy-efficient choice for telecommunications applications.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for precise connections and efficient signal transmission, ensuring reliable performance in telecommunications networks.

Technical Specifications

ATM/SONET/SDH Circuits SY87701ALHG-TR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

160 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

SY87701ALHG-TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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