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SY75612TWL

Microchip Technology

SY75612TWL by Microchip Technology

SY75612TWL by Microchip Tech: 1.5 ns Propagation Delay, 250 MHz fmax, 24 True Outputs. Clock driver for applications requiring high-speed signal conditioning and precise timing synchronization in electronic systems.

Median Price

$2.905

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 27,820 parts In-Stock

1+ parts

$2.860

100+ parts

$2.160

1k+ parts

$2.090

10k+ parts

$2.070

27,820

$2.860

$2.160

$2.090

$2.070

DigiKey

USA . 136 parts In-Stock

1+ parts

$2.950

100+ parts

$2.375

1k+ parts

-

10k+ parts

-

136

$2.950

$2.375

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

LOOK Integrated Logistics

Peru . 7,657 parts In-Stock

1+ parts

-

100+ parts

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7,657

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Montano Global Distributors

Canada . 5,096 parts In-Stock

1+ parts

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5,096

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LMD Electronica

Estonia . 4,914 parts In-Stock

1+ parts

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4,914

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Microchip USA

USA . 2,559 parts In-Stock

1+ parts

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2,559

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NIA Electronics

USA . 629 parts In-Stock

1+ parts

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629

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Ledger Components

France . 629 parts In-Stock

1+ parts

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629

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Overview

Elevate your electronic designs with the SY75612TWL clock driver/buffer from Microchip Technology. Known for their top-quality manufacturing, Microchip delivers reliable components that exceed industry standards. Clock drivers & buffers are essential for ensuring precise timing in various applications, and this product stands out with its fast propagation delay and 3-state output characteristics. With a nominal supply voltage of 1.8V and a terminal pitch of 0.5mm, the SY75612TWL offers unmatched value and performance. Trust Microchip to provide the innovative solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 1.5 ns

With a low propagation delay, this clock driver and buffer can efficiently synchronize signals and reduce overall system latency.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL MUX

The input conditioning with a differential multiplexer enables precise signal processing and high signal integrity, ensuring accurate clock distribution.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V reduces power consumption and heat dissipation, making it energy-efficient.

No. of Terminals: 56

Having a high number of terminals allows for versatile connectivity options, supporting complex clock distribution requirements.

Propagation Delay (tpd): 1.5 ns

The consistent propagation delay of 1.5 ns ensures reliable and synchronized clock signals across the system.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the clock driver and buffer can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance in cold environments or during temperature fluctuations.

Minimum Supply Voltage (Vsup): 1.62 V

The low minimum supply voltage requirement of 1.62V allows for compatibility with a wide range of power sources.

No. of True Outputs: 24

Having 24 true outputs provides flexibility in signal distribution, accommodating various system architectures and requirements.

Minimum fmax: 250 MHz

The high minimum frequency fmax of 250 MHz allows for fast data processing and clock distribution, enhancing system performance.

Maximum Supply Voltage (Vsup): 1.98 V

Operating within a safe maximum supply voltage limit of 1.98V ensures the longevity and reliability of the clock driver and buffer.

Maximum Power Supply Current (ICC): 35 mA

The maximum power supply current of 35 mA indicates efficient power usage, minimizing energy consumption and heat generation.

Technical Specifications

Clock Drivers & Buffers SY75612TWL attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY

Family:

SY756

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N56

Length:

8 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

56

No. of True Outputs:

24

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TRAY

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay At Nominal Supply:

1.5 ns

Propagation Delay (tpd):

1.5 ns

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.98 V

Minimum Supply Voltage (Vsup):

1.62 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Minimum fmax:

250 MHz

Trade Compliance

SY75612TWL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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