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SST39VF6401B-70-4C-B1KE-T

Microchip Technology

SST39VF6401B-70-4C-B1KE-T by Microchip Technology

SST39VF6401B-70-4C-B1KE-T by Microchip: 3V NOR Flash Memory, 4Mx16 organization, 2K sectors. Ideal for commercial applications requiring fast access time and high endurance with a max operating temperature of 70°C.

Median Price

$13.880

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$13.880

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$13.880

-

-

-

Vyrian

USA . 2,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,646

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$9.034

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$9.034

-

-

-

Ampacity Inc.

Singapore . 1,164 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$27.000

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-

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Marpe Global Electronics

Taiwan . 7,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,525

-

-

-

-

QualityLine Systems

Poland . 7,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,525

-

-

-

-

XL Components Corporation

Australia . 7,525 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,525

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-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$13.602

1k+ parts

$13.186

10k+ parts

$12.908

2,000

-

$13.602

$13.186

$12.908

Microchip USA

USA . 193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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193

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Overview

Experience top-notch quality and reliability with the Microchip Technology SST39VF6401B-70-4C-B1KE-T Flash Memory. This innovative product offers unmatched performance in a wide range of applications thanks to its cutting-edge technology and exceptional design. From consumer electronics to automotive systems, this flash memory provides superior data storage solutions that exceed expectations. Trust Microchip Technology to deliver excellence in every aspect, ensuring that your projects run smoothly and efficiently. Elevate your products with the SST39VF6401B-70-4C-B1KE-T and enjoy the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent and flexible data access, enhancing the overall performance of the flash memory.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage ensures compatibility with a wide range of electronic devices, making it a versatile option for various applications.

Endurance: 100000 Write/Erase Cycles

With a high endurance rating of 100,000 write/erase cycles, this flash memory offers reliable and long-lasting storage capabilities.

Technical Specifications

Flash Memory SST39VF6401B-70-4C-B1KE-T attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

2K

No. of Terminals:

48

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

2K

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

8 mm

Trade Compliance

SST39VF6401B-70-4C-B1KE-T Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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