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SST39VF3202C-70-4I-B3KE-T

Microchip Technology

SST39VF3202C-70-4I-B3KE-T by Microchip Technology

SST39VF3202C-70-4I-B3KE-T by Microchip: 2MX16 NOR Flash Memory with 3V supply, 70ns access time. Ideal for industrial applications, featuring 100K cycles endurance and 2097152 words capacity in a compact GRID ARRAY package.

Median Price

$3.210

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 39,800 parts In-Stock

1+ parts

$3.210

100+ parts

$2.490

1k+ parts

$2.160

10k+ parts

$2.080

39,800

$3.210

$2.490

$2.160

$2.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 32,500 parts In-Stock

1+ parts

$2.890

100+ parts

$2.610

1k+ parts

$2.350

10k+ parts

-

32,500

$2.890

$2.610

$2.350

-

Chip Stock

USA . 27,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,040

-

-

-

-

Vyrian

USA . 3,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,461

-

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 44,541 parts In-Stock

1+ parts

$2.730

100+ parts

-

1k+ parts

-

10k+ parts

-

44,541

$2.730

-

-

-

AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$10.700

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$10.700

-

-

-

Microchip USA

USA . 5,077 parts In-Stock

1+ parts

$16.253

100+ parts

-

1k+ parts

-

10k+ parts

-

5,077

$16.253

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Fulton Briggs Corp.

USA . 196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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196

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-

Overview

Enhance your electronic devices with the Microchip Technology SST39VF3202C-70-4I-B3KE-T Flash Memory. Known for their high-quality products, Microchip Technology brings you a reliable and versatile memory solution perfect for various applications. This Flash Memory offers fast access times, low power consumption, and high endurance, providing value and performance to customers. Upgrade your systems with this top-notch product and experience seamless operation and enhanced efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the flash memory, ensuring a longer lifespan for the product.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent operation of the flash memory, leading to efficient performance and flexibility in data access.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this flash memory can withstand high temperatures, making it suitable for industrial applications where heat can be a factor.

Memory Density: 33554432 bit

The high memory density of 33554432 bit ensures ample storage capacity for data, making this flash memory ideal for storing large amounts of information.

Endurance: 100000 Write/Erase Cycles

The flash memory's endurance of 100000 write/erase cycles indicates strong reliability and longevity, making it a dependable choice for frequent data read/write operations.

Technical Specifications

Flash Memory SST39VF3202C-70-4I-B3KE-T attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

TOP BOOT BLOCK

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

8,63

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K,32K

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

SST39VF3202C-70-4I-B3KE-T Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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