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SST39VF3201C-70-4I-B3KE-T

Microchip Technology

SST39VF3201C-70-4I-B3KE-T by Microchip Technology

SST39VF3201C-70-4I-B3KE-T by Microchip: 2MX16 NOR Flash Memory with 3V supply, 70ns access time. Ideal for industrial applications requiring high endurance (100K cycles) and fast data polling. Features 8 sectors, 2097152 words, and common flash interface for parallel programming.

Median Price

$3.210

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,500 parts In-Stock

1+ parts

$3.210

100+ parts

$2.490

1k+ parts

$2.160

10k+ parts

$2.080

2,500

$3.210

$2.490

$2.160

$2.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.490

100+ parts

-

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10

$2.490

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Lantek

USA . 10,000 parts In-Stock

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10,000

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Vyrian

USA . 8,764 parts In-Stock

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8,764

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Distributors (Availability)

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Netroflash

USA . 50 parts In-Stock

1+ parts

$2.490

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-

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50

$2.490

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Aztec Data Supply Inc.

USA . 156 parts In-Stock

1+ parts

$3.240

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156

$3.240

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Corohmni

South Africa . 1,022 parts In-Stock

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$3.400

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1,022

$3.400

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AZTECH Wire

Italy . 738 parts In-Stock

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$10.680

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738

$10.680

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Microchip USA

USA . 4,290 parts In-Stock

1+ parts

$16.253

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4,290

$16.253

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Ampacity Inc.

Singapore . 951 parts In-Stock

1+ parts

$21.000

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951

$21.000

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Semicontronic

India . 759 parts In-Stock

1+ parts

$28.000

100+ parts

$27.300

1k+ parts

$27.160

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759

$28.000

$27.300

$27.160

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QUARKTWIN TECHNOLOGY LTD

USA . 14,527 parts In-Stock

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14,527

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Argo Parts USA

USA . 4,116 parts In-Stock

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West Coast Incorporated

USA . 2,473 parts In-Stock

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2,473

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 759 parts In-Stock

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759

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Overview

Unlock the power of reliable and high-quality flash memory with the SST39VF3201C-70-4I-B3KE-T by Microchip Technology. As a trusted manufacturer in the industry, Microchip Technology delivers cutting-edge solutions for various applications. This flash memory device offers impeccable value to customers with its endurance of 100,000 Write/Erase cycles, fast access time of 70 ns, and versatile organization of 2MX16. Whether you need it for industrial, commercial, or consumer electronics, this Flash Memory is designed to meet your needs efficiently and effectively. Trust Microchip Technology for superior performance and reliability in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the flash memory, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on PCBs, saving space and making assembly more efficient.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent data transfers, improving overall performance of the flash memory.

Nominal Supply Voltage: 3V

Operating at a nominal supply voltage of 3V ensures compatibility with many electronic devices, making it versatile for various applications.

Memory Density: 33554432 bit

High memory density allows for storing a large amount of data in a compact form factor, making it suitable for applications that require a lot of storage space.

Endurance: 100000 Write/Erase Cycles

With a high endurance rating of 100,000 write/erase cycles, this flash memory offers reliability and longevity for frequent data read/write operations.

Technical Specifications

Flash Memory SST39VF3201C-70-4I-B3KE-T attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

8,63

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K,32K

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

SST39VF3201C-70-4I-B3KE-T Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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