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PM8070B1-F3EI

Microchip Technology

PM8070B1-F3EI by Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Terminal Form: BALL; No. of Terminals: 1071; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

Median Price

$238.760

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,720 parts In-Stock

1+ parts

$238.760

100+ parts

$180.900

1k+ parts

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10k+ parts

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3,720

$238.760

$180.900

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Sense

UK . 3,073 parts In-Stock

1+ parts

-

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3,073

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NIA Electronics

USA . 8,125 parts In-Stock

1+ parts

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8,125

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Ledger Components

France . 8,125 parts In-Stock

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8,125

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LMD Electronica

Estonia . 8,103 parts In-Stock

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8,103

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Montano Global Distributors

Canada . 5,546 parts In-Stock

1+ parts

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5,546

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LOOK Integrated Logistics

Peru . 415 parts In-Stock

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415

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Technical Specifications

Serial Communication Controllers PM8070B1-F3EI attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Boundary Scan:

NO

Bus Compatibility:

PCI, UART

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

1000 MBps

JESD-30 Code:

S-PBGA-B1071

Low Power Mode:

NO

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1071(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM8070B1-F3EI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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