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PIC32MZ2064DAR176T-V/2J

Microchip Technology

PIC32MZ2064DAR176T-V/2J by Microchip Technology

PIC32MZ2064DAR176T-V/2J by Microchip: 32-bit RISC CPU, 64 MHz clock, 45-Ch ADC. Ideal for automotive applications with AEC-Q100 screening, low power mode, and extensive peripheral support like I2C, SPI, UART.

Median Price

$23.090

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$23.090

100+ parts

-

1k+ parts

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10k+ parts

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550

$23.090

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Vyrian

USA . 2,090 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,090

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 633 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

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633

$14.000

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AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$19.250

100+ parts

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1k+ parts

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10k+ parts

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803

$19.250

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$22.628

100+ parts

-

1k+ parts

$21.723

10k+ parts

-

2,000

$22.628

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$21.723

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Fulton Briggs Corp.

USA . 553 parts In-Stock

1+ parts

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553

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Overview

Discover the power and innovation of the PIC32MZ2064DAR176T-V/2J microcontroller by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-quality products that are reliable and efficient. This microcontroller is perfect for a wide range of applications, offering advanced features like integrated cache, low power mode, and multiple connectivity options. Experience the value and benefits of this product, designed to meet your needs and exceed your expectations. Elevate your projects with the PIC32MZ2064DAR176T-V/2J and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it ideal for various applications.

Integrated Cache: YES

Integrated cache helps improve the overall performance of the microcontroller by reducing access time to frequently used data and instructions.

Maximum Supply Voltage: 1.9 V

The maximum supply voltage of 1.9V ensures the safe operation of the microcontroller within specified limits.

No. of External Interrupts: 5

Having 5 external interrupts allows the microcontroller to efficiently handle and respond to external events or signals.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data for processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture, it offers high performance and efficiency in executing instructions.

Maximum Clock Frequency: 64 MHz

With a high maximum clock frequency of 64 MHz, the microcontroller can handle complex tasks and operations at a faster rate.

Analog To Digital Convertors: 45-Ch 12-Bit

Having 45 channels for analog to digital conversion with 12-bit resolution ensures accurate and precise conversion of analog signals.

No. of I/O Lines: 120

A large number of I/O lines allow for a wide range of connectivity options and interfaces, making it versatile for different applications.

Technical Specifications

Microcontrollers PIC32MZ2064DAR176T-V/2J attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

120

No. of Serial I/Os:

5

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,.87SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

655360

RAM Words:

655360

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Current:

172 mA

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(5), I2S(6), SPI(6), UART(6)

Peripherals:

BOR, COMPARATOR(2), POR, RTCC, TIMER(11), WDT

Analog To Digital Convertors:

45-Ch 12-Bit

Trade Compliance

PIC32MZ2064DAR176T-V/2J Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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