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PIC32MZ1024EFG064T-I/MR

Microchip Technology

PIC32MZ1024EFG064T-I/MR by Microchip Technology

PIC32MZ1024EFG064T-I/MR by Microchip Technology is a 32-bit microcontroller with 64 MHz clock frequency, 24-Ch 12-Bit ADC, and 3.6V max supply voltage. It is ideal for industrial applications requiring low power mode, featuring CAN, Ethernet, I2C, SPI connectivity options and extensive peripheral support like DMA(12) and PWM(9).

Median Price

$13.925

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 49 parts In-Stock

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$13.925

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Vyrian

USA . 8,756 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$13.925

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100

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AZTECH Wire

Italy . 778 parts In-Stock

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$15.795

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Ampacity Inc.

Singapore . 354 parts In-Stock

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$23.000

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Corohmni

South Africa . 6 parts In-Stock

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$29.880

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6

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Aztec Data Supply Inc.

USA . 910 parts In-Stock

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$39.390

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910

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Lixinc

USA . 12,632 parts In-Stock

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XL Components Corporation

Australia . 6,715 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,413 parts In-Stock

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Continental Prestige Electronics

USA . 3,417 parts In-Stock

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Argo Parts USA

USA . 3,203 parts In-Stock

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QualityLine Systems

Poland . 888 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology PIC32MZ1024EFG064T-I/MR microcontroller. Built by an industry leader known for quality and innovation, this versatile microcontroller is perfect for a wide range of applications. From industrial automation to consumer electronics, the PIC32MZ1024EFG064T-I/MR offers unmatched performance and reliability. Experience the value and benefits it brings to your projects, with advanced features like integrated cache, low power mode, and a wide range of connectivity options. Embrace the future of technology with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various industrial applications.

Integrated Cache: YES

The integrated cache helps in improving the overall performance of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 3.6 V

Having a higher maximum supply voltage allows the microcontroller to operate efficiently with a wider range of power sources.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and storage within the microcontroller.

Screening Level: TS 16949

The TS 16949 screening level ensures high-quality standards in terms of reliability and performance.

Bit Size: 32

A larger bit size allows the microcontroller to handle complex data processing tasks with precision.

No. of Terminals: 64

Having a higher number of terminals enables connectivity with a wide range of external devices and peripherals.

ROM Words: 1048576

With a large ROM capacity, the microcontroller can store a significant amount of program code and data for efficient operation.

Technical Specifications

Microcontrollers PIC32MZ1024EFG064T-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

46

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

524288

RAM Words:

524288

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.9 mm

Speed:

200 rpm

Maximum Supply Current:

130 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

PIC32MZ1024EFG064T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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