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PIC32MX675F256H-80V/MR

Microchip Technology

PIC32MX675F256H-80V/MR by Microchip Technology

PIC32MX675F256H-80V/MR by Microchip: 32-bit RISC CPU, 50 MHz clock, 65536 RAM words. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include 16-Ch ADC, 8 DMA channels, and connectivity options like Ethernet and USB.

Median Price

$10.360

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 120 parts In-Stock

1+ parts

$10.360

100+ parts

$9.050

1k+ parts

$8.620

10k+ parts

-

120

$10.360

$9.050

$8.620

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.410

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$9.410

-

-

-

Vyrian

USA . 8,292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,292

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17 parts In-Stock

1+ parts

$8.810

100+ parts

-

1k+ parts

-

10k+ parts

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17

$8.810

-

-

-

Continental Prestige Electronics

USA . 3,143 parts In-Stock

1+ parts

$9.410

100+ parts

-

1k+ parts

-

10k+ parts

$9.221

3,143

$9.410

-

-

$9.221

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$9.410

100+ parts

-

1k+ parts

$8.939

10k+ parts

$8.751

2,000

$9.410

-

$8.939

$8.751

AZTECH Wire

Italy . 892 parts In-Stock

1+ parts

$14.293

100+ parts

-

1k+ parts

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10k+ parts

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892

$14.293

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-

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Corohmni

South Africa . 53 parts In-Stock

1+ parts

$54.789

100+ parts

-

1k+ parts

-

10k+ parts

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53

$54.789

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,000

-

-

-

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Argo Parts USA

USA . 3,272 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,272

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West Coast Incorporated

USA . 171 parts In-Stock

1+ parts

-

100+ parts

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171

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Overview

Experience unparalleled performance and reliability with the Microchip Technology PIC32MX675F256H-80V/MR microcontroller. As a leading manufacturer in the industry, Microchip Technology delivers state-of-the-art solutions for a wide range of applications. With integrated cache, high-speed processing capabilities, and a variety of peripherals, this microcontroller offers unmatched value and efficiency for your projects. Whether you're designing IoT devices, automotive systems, or consumer electronics, the PIC32MX675F256H-80V/MR is the perfect choice to bring your ideas to life. Trust in Microchip Technology's expertise and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and allows for the efficient production of the microcontroller, making it a budget-friendly option.

No. of Terminals: 64

With a large number of terminals, this microcontroller can support various connections and peripherals, making it versatile for different applications.

Maximum Clock Frequency: 50 MHz

The high clock frequency allows for fast processing speeds, making it suitable for applications that require quick data processing.

Analog To Digital Convertors: 16-Ch 10-Bit

With 16 analog to digital converters and 10-bit resolution, this microcontroller can accurately convert analog signals to digital data for precise measurements.

Connectivity: ETHERNET, I2C(5), SPI(4), UART(6), USB

The various connectivity options make it easy to communicate with other devices, expanding the range of applications this microcontroller can be used for.

Technical Specifications

Microcontrollers PIC32MX675F256H-80V/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

80 rpm

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(5), SPI(4), UART(6), USB

Peripherals:

BOR, COMPARATOR(2), DMA(8), POR, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

PIC32MX675F256H-80V/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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