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PIC32MX270F256DT-I/PT

Microchip Technology

PIC32MX270F256DT-I/PT by Microchip Technology

PIC32MX270F256DT-I/PT by Microchip: 32-bit RISC CPU, 262144 ROM words, 65536 RAM words. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include 13-Ch ADC, USB connectivity, and 5 timers for versatile functionality.

Median Price

$5.714

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

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$5.714

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870

$5.714

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Vyrian

USA . 8,944 parts In-Stock

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8,944

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,950 parts In-Stock

1+ parts

$5.714

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$5.600

5,950

$5.714

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$5.600

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$5.829

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$5.829

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$5.829

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500

$5.829

$5.829

$5.829

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AZTECH Wire

Italy . 713 parts In-Stock

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$8.595

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Semicontronic

India . 910 parts In-Stock

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$12.000

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$11.700

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$11.640

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910

$12.000

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$11.640

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Ampacity Inc.

Singapore . 490 parts In-Stock

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$13.000

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490

$13.000

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Corohmni

South Africa . 658 parts In-Stock

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$75.361

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Aztec Data Supply Inc.

USA . 3,579 parts In-Stock

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$77.380

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QUARKTWIN TECHNOLOGY LTD

USA . 27,168 parts In-Stock

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LMD Electronica

Estonia . 5,756 parts In-Stock

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Infinite Electronics LLP (Excess)

. 4,929 parts In-Stock

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Montano Global Distributors

Canada . 4,193 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,949 parts In-Stock

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Argo Parts USA

USA . 2,574 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$5.600

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$5.429

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$5.314

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$5.429

$5.314

NIA Electronics

USA . 421 parts In-Stock

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Ledger Components

France . 421 parts In-Stock

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Overview

Unlock endless possibilities with the Microchip Technology PIC32MX270F256DT-I/PT microcontroller. Boasting top-notch quality and reliability from a trusted manufacturer, this versatile device is the perfect solution for a wide range of applications. With advanced features and high performance, customers can enjoy seamless operation and enhanced functionality. Experience the value and benefits that this product brings to your projects, setting you apart from the competition. Upgrade your designs today with the PIC32MX270F256DT-I/PT microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, giving flexibility in system design.

ADC Channels: YES

Ability to perform analog to digital conversion, enabling the microcontroller to process analog signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and high performance in a compact form factor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Technical Specifications

Microcontrollers PIC32MX270F256DT-I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

33

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX270F256DT-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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