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PIC32MX174F256D-V/ML

Microchip Technology

PIC32MX174F256D-V/ML by Microchip Technology

PIC32MX174F256D-V/ML by Microchip: 32-bit RISC microcontroller with 50 MHz clock, 35 I/O lines, and Flash ROM. Ideal for industrial applications requiring high-speed processing, ADC/DMA channels, and PWM capabilities in a compact chip carrier package. Operating range from -40 to 105°C makes it suitable for various temperature environments.

Median Price

$6.150

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 630 parts In-Stock

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$6.150

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$5.100

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$4.700

10k+ parts

$4.460

630

$6.150

$5.100

$4.700

$4.460

DigiKey

USA . 135 parts In-Stock

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$6.150

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$5.100

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$5.100

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Verical

USA . 45 parts In-Stock

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$10.612

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45

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Distributors (In-Stock)

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NAC Semi

USA . 495 parts In-Stock

1+ parts

$6.380

100+ parts

$5.790

1k+ parts

$5.290

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-

495

$6.380

$5.790

$5.290

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TME

Poland . 45 parts In-Stock

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$8.840

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$7.550

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45

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$7.550

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Vyrian

USA . 6,258 parts In-Stock

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Nova Conductors

Japan . 22 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 255 parts In-Stock

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$11.380

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$11.380

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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NIA Electronics

USA . 8,117 parts In-Stock

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Ledger Components

France . 8,117 parts In-Stock

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LMD Electronica

Estonia . 6,894 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,290 parts In-Stock

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Microchip USA

USA . 3,971 parts In-Stock

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Montano Global Distributors

Canada . 2,988 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,243 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Overview

Experience the power of innovation with the PIC32MX174F256D-V/ML by Microchip Technology, a top-quality microcontroller designed to elevate your projects to new heights. With AEC-Q100 and TS 16949 screening levels, this chip offers unparalleled reliability and durability for industrial applications. Whether you're working on automation, robotics, or IoT devices, the PIC32MX174F256D-V/ML delivers exceptional performance with its 32-bit architecture and powerful features like ADC and DMA channels. Trust Microchip Technology to provide cutting-edge solutions that exceed expectations and bring your ideas to life.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good insulation and protection for the microcontroller, ensuring durability and reliability in various operating conditions.

Maximum Clock Frequency - 50 MHz

High clock frequency allows for fast processing and execution of tasks, making this microcontroller suitable for applications that require high speed performance.

ADC Channels - YES

Having ADC (Analog-to-Digital Converter) channels allows the microcontroller to interface with analog sensors and signals, enabling measurement and processing of real-world data.

ROM Programmability - FLASH

The flash ROM programmability feature allows for easy and flexible updating of the microcontroller's firmware, ensuring adaptability and scalability for future enhancements and improvements.

Peripheral IC Type - MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller with various built-in peripheral ICs makes it efficient in handling tasks with fewer instructions and lower power consumption, suitable for energy-efficient applications.

Technical Specifications

Microcontrollers PIC32MX174F256D-V/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

12 KB BOOT FLASH MEMORY AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N44

Length:

8 mm

No. of I/O Lines:

35

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Peripheral IC Type:

Trade Compliance

PIC32MX174F256D-V/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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