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PIC24HJ256GP610A-H/PF

Microchip Technology

PIC24HJ256GP610A-H/PF by Microchip Technology

PIC24HJ256GP610A-H/PF by Microchip: 16-bit microcontroller with 262144 ROM words, 16384 RAM bytes, and 85 I/O lines. Ideal for automotive applications due to -40 to 150 °C operating temp range and CMOS technology. Features include 40 MHz clock frequency, ADC/DMA channels, and PWM support.

Median Price

$8.380

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 450 parts In-Stock

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$8.380

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$8.380

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$16.150

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50

$16.150

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Vyrian

USA . 7,896 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 42 parts In-Stock

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$11.800

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42

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$14.622

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$14.622

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$14.622

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10

$14.622

$14.622

$14.622

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Continental Prestige Electronics

USA . 2,010 parts In-Stock

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$16.150

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$15.827

2,010

$16.150

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$15.827

Netroflash

USA . 500 parts In-Stock

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$16.150

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$16.150

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AZTECH Wire

Italy . 202 parts In-Stock

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$19.571

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Ampacity Inc.

Singapore . 417 parts In-Stock

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$22.010

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417

$22.010

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Semicontronic

India . 63 parts In-Stock

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$22.010

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$21.460

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$21.350

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63

$22.010

$21.460

$21.350

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Aztec Data Supply Inc.

USA . 152 parts In-Stock

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$47.200

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QualityLine Systems

Poland . 8,231 parts In-Stock

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Marpe Global Electronics

Taiwan . 7,924 parts In-Stock

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Argo Parts USA

USA . 3,664 parts In-Stock

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XL Components Corporation

Australia . 1,827 parts In-Stock

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Microchip USA

USA . 347 parts In-Stock

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Perfect Parts

USA . 207 parts In-Stock

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Overview

Experience unmatched performance and reliability with the PIC24HJ256GP610A-H/PF microcontroller by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers cutting-edge solutions for various applications in the microcontroller category. This powerful 16-bit microcontroller offers customers exceptional value with its high-quality design, efficient power management, and versatile capabilities. Whether you're designing automotive systems or industrial controls, this product provides the perfect balance of performance and flexibility to meet your specific needs. Upgrade your projects today with the PIC24HJ256GP610A-H/PF and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable construction for the microcontroller, ensuring longevity and stability in various operating conditions.

Surface Mount: YES

Enables easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, offering flexibility in design and integration.

Package Shape: SQUARE

Optimizes space utilization on the PCB, making it suitable for compact and dense electronic applications.

Bit Size: 16

Provides a balance between processing power and complexity, suitable for a variety of embedded systems applications.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 100

Offers a sufficient number of connection points for interfacing with various external devices and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE

Facilitates a space-saving and compact design layout, ideal for applications where size constraints are a concern.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower voltage levels, providing flexibility in power source selection.

Maximum Operating Temperature: 150 °C

Suitable for use in high-temperature environments, offering dependable performance under challenging conditions.

CPU Family: PIC24

Belongs to a well-established and reliable microcontroller family known for its performance and versatility in embedded systems.

Minimum Operating Temperature: -40 °C

Designed to function in extreme cold conditions, making it suitable for a wide range of environments and applications.

Terminal Finish: Matte Tin (Sn)

Provides a corrosion-resistant and durable terminal finish, ensuring long-term reliability and robustness.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for precise and accurate conversion of analog signals, enabling sensor interfacing and data acquisition.

DMA Channels: YES

Featuring Direct Memory Access channels for efficient data transfer, reducing CPU overhead and enhancing overall system performance.

Terminal Position: QUAD

Arrangement of terminals in a quad configuration for ease of soldering and PCB layout, enhancing manufacturing efficiency.

ROM Words: 262144

Offers ample memory capacity for program storage, data logging, and application-specific firmware requirements.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications, enabling compact electronic designs without compromising performance.

Width: 14 mm

Compact form factor for easy integration into various PCB layouts, suitable for applications with limited space constraints.

Maximum Clock Frequency: 40 MHz

High-speed processing capability for quick and efficient execution of instructions, ideal for real-time and computationally intensive applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process within specified time limits, safeguarding component integrity during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing processes, ensuring reliable solder joints and component connections.

Length: 14 mm

Compact and standardized length dimension for easy and uniform placement on the PCB, simplifying assembly and layout design.

Temperature Grade: AUTOMOTIVE

Meets stringent automotive industry standards for temperature range and reliability, suitable for automotive applications and harsh operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing, offering high performance and low power consumption.

RAM Bytes: 16384

Sufficient Random Access Memory for data storage and temporary information processing, facilitating multitasking and complex algorithm execution.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption, high noise immunity, and reliable performance in various applications.

Terminal Form: GULL WING

Gull-wing terminal arrangement for easy surface mount soldering, ensuring secure and reliable electrical connections during PCB assembly.

Nominal Supply Voltage: 3.3 V

Standard voltage level for stable and efficient operation, compatible with a wide range of power sources and electronic components.

PWM Channels: YES

Includes Pulse Width Modulation channels for precise control of analog signals and motor speed, enabling sophisticated control algorithms and voltage regulation.

ROM Programmability: FLASH

Flash memory technology for easy reprogramming and firmware updates, facilitating rapid development cycles and easy debugging of applications.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing for high-density mounting on the PCB, enabling compact designs and reducing overall board footprint.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage conditions to prevent potential damage during assembly.

Speed: 20 rpm

Offers a processing speed of 20 revolutions per minute, suitable for controlling stepper motors and other rotational applications with precision and efficiency.

No. of I/O Lines: 85

Ample Input/Output lines for interfacing with external devices, sensors, actuators, and peripherals, enabling versatile connectivity and system integration.

Technical Specifications

Microcontrollers PIC24HJ256GP610A-H/PF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

PIC24

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

85

No. of Terminals:

100

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PIC24HJ256GP610A-H/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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