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PIC24FJ128GA702T-I/MV

Microchip Technology

PIC24FJ128GA702T-I/MV by Microchip Technology

PIC24FJ128GA702T-I/MV by Microchip: 16-bit RISC CPU, 131072 ROM words, 48 MHz max clock freq. Ideal for industrial applications with ADC, DMA, PWM channels and I2C, LIN, SPI connectivity. Operating temp -40 to 85 °C.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

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10k+ parts

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50

$1.320

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Vyrian

USA . 8,934 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,078 parts In-Stock

1+ parts

$1.320

100+ parts

-

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4,078

$1.320

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Continental Prestige Electronics

USA . 2,257 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

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10k+ parts

$1.294

2,257

$1.320

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-

$1.294

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

$1.254

10k+ parts

$1.228

100

$1.320

-

$1.254

$1.228

Ampacity Inc.

Singapore . 3,222 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

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3,222

$1.570

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$15.460

100+ parts

-

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565

$15.460

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Corohmni

South Africa . 291 parts In-Stock

1+ parts

$63.351

100+ parts

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291

$63.351

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Aztec Data Supply Inc.

USA . 4,751 parts In-Stock

1+ parts

$71.844

100+ parts

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4,751

$71.844

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RGB Technical Solutions

Ukraine . 7,647 parts In-Stock

1+ parts

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7,647

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Enhance your projects with the PIC24FJ128GA702T-I/MV by Microchip Technology, a top-tier microcontroller designed to elevate your creations to new heights. With a focus on quality and innovation, Microchip Technology ensures that this product meets the highest industry standards. Perfect for a wide range of applications, this microcontroller offers unmatched value and benefits to customers. Experience seamless connectivity, superior performance, and reliable operation with the PIC24FJ128GA702T-I/MV. Let your imagination run wild and bring your ideas to life with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Provides a wide range of power options for flexibility in different applications.

On Chip Data RAM Width: 8

The wide data RAM width enables faster data processing and storage capabilities.

Screening Level: TS 16949

Ensures high quality and reliability, making it suitable for demanding industrial applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board.

Bit Size: 16

The large bit size enhances processing power and performance of the microcontroller.

No. of Terminals: 28

Provides ample connectivity options for interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

These package styles offer versatility and efficient heat dissipation for optimal performance.

Minimum Supply Voltage: 2 V

Allows for operation in low power environments, extending the lifespan of the product.

Maximum Operating Temperature: 85 °C

Enables operation in a wide range of temperature conditions, suitable for various environments.

CPU Family: PIC24

Belongs to a renowned family of microcontrollers known for their performance and reliability.

No. of External Interrupts: 5

The multiple external interrupts allow for efficient handling of external events and signals.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for a diverse range of environments.

ADC Channels: YES

Includes analog-to-digital converters for precise measurements and sensor data acquisition.

DMA Channels: YES

Incorporates direct memory access channels for efficient data transfer and processing.

Terminal Position: QUAD

The quad terminal position offers ease of connection and integration with other components.

ROM Words: 131072

Provides ample storage capacity for program instructions and data.

Maximum Seated Height: 0.55 mm

The low seated height allows for compact and slim designs in electronic products.

Width: 4 mm

The compact width makes it suitable for small form factor applications.

Boundary Scan: YES

Includes boundary scan capabilities for efficient testing and debugging during development.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, RTCC, TIMER(3), WDT

Offers a wide range of peripherals for enhanced functionality and versatility.

Maximum Clock Frequency: 48 MHz

The high clock frequency supports fast and efficient processing of instructions.

Length: 4 mm

The short length enables space-saving designs in electronic devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges for robust performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Employs a microcontroller with reduced instruction set computing architecture for efficient processing.

No. of Timers: 3

Includes multiple timers for precise timing and scheduling of tasks.

RAM Bytes: 16384

Provides a generous amount of random access memory for data storage and manipulation.

Technology: CMOS

Utilizes complementary metal-oxide-semiconductor technology for low power consumption and high speed.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and offers long-term reliability.

Analog To Digital Convertors: 10-Ch 12-Bit

Features multiple analog-to-digital converters with high precision for accurate voltage measurements.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and consistent power delivery for reliable operation.

No. of DMA Channels: 6

The six DMA channels support concurrent data transfers for enhanced performance.

PWM Channels: YES

Includes pulse-width modulation channels for precise control of analog signals.

Connectivity: I2C(2), LIN, SPI(3),UART(2)

Offers multiple communication interfaces for connecting with external devices and peripherals.

ROM Programmability: FLASH

The flash ROM allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.4 mm

The fine terminal pitch enables high-density mounting on circuit boards for compact designs.

Format: FIXED POINT

Utilizes fixed-point arithmetic for efficient mathematical operations and data processing.

Speed: 32 rpm

Capable of processing at a speed of 32 rotations per minute for quick execution of tasks.

Low Power Mode: YES

Includes a low power mode for energy efficiency and extended battery life.

On Chip Program ROM Width: 8

The wide program ROM width enhances program storage and execution efficiency.

No. of I/O Lines: 22

Provides a sufficient number of input and output lines for versatile connectivity options.

Technical Specifications

Microcontrollers PIC24FJ128GA702T-I/MV attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

22

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.55 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LIN, SPI(3),UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, RTCC, TIMER(3), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

PIC24FJ128GA702T-I/MV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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