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PIC16F685-E/ML

Microchip Technology

PIC16F685-E/ML by Microchip Technology

PIC16F685-E/ML by Microchip Technology is an 8-bit microcontroller with 4096 ROM words and 256 bytes of RAM. Operating at a max frequency of 20 MHz, it features 12-Ch 10-Bit ADC channels and supports I2C, SPI, and USB connectivity. Ideal for automotive applications due to AEC-Q100 screening level and wide temperature range from -40°C to 125°C.

Median Price

$2.705

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 276 parts In-Stock

1+ parts

$2.670

100+ parts

$2.280

1k+ parts

$2.080

10k+ parts

$1.960

276

$2.670

$2.280

$2.080

$1.960

Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$2.740

100+ parts

-

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37

$2.740

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.963

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50

$2.963

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NAC Semi

USA . 182 parts In-Stock

1+ parts

$3.150

100+ parts

$2.850

1k+ parts

$2.610

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-

182

$3.150

$2.850

$2.610

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Vyrian

USA . 4,432 parts In-Stock

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Semi Source

USA . 51 parts In-Stock

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51

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Distributors (Availability)

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Ampacity Inc.

Singapore . 111 parts In-Stock

1+ parts

$2.270

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111

$2.270

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.963

100+ parts

$2.904

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1,000

$2.963

$2.904

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QUARKTWIN TECHNOLOGY LTD

USA . 28,940 parts In-Stock

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28,940

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Lixinc

USA . 16,729 parts In-Stock

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16,729

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Marpe Global Electronics

Taiwan . 5,337 parts In-Stock

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QualityLine Systems

Poland . 5,337 parts In-Stock

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5,337

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XL Components Corporation

Australia . 5,337 parts In-Stock

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5,337

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Overview

Enhance your electronic designs with the powerful PIC16F685-E/ML microcontroller by Microchip Technology. With a focus on quality and reliability, Microchip is a trusted name in the industry. This versatile microcontroller offers a wide range of applications in various industries, providing value and benefits to customers seeking efficient and innovative solutions. Experience seamless connectivity, low power mode, and exceptional performance with the PIC16F685-E/ML, setting the standard for excellence in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 5.5 V

The higher supply voltage allows for versatility in power supply options, making it compatible with a wide range of applications.

ADC Channels: YES

The presence of Analog to Digital Converters (ADC) allows for precise and accurate conversion of analog signals, enabling the microcontroller to interface with various sensors.

ROM Words: 4096

With a large ROM capacity, the microcontroller can store a significant amount of program instructions and data, making it suitable for complex applications.

Connectivity: I2C, SPI, USB

The availability of multiple connectivity options such as I2C, SPI, and USB enhances the versatility and interoperability of the microcontroller with other devices and systems.

Technical Specifications

Microcontrollers PIC16F685-E/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2V SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

2

No. of I/O Lines:

18

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USB

Peripherals:

BOD, COMPARATOR(2), POR, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

PIC16F685-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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