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PIC16F1946T-I/MR

Microchip Technology

PIC16F1946T-I/MR by Microchip Technology

PIC16F1946T-I/MR by Microchip: 16-bit, 32MHz MCU with 512B RAM, 8192 ROM words. Features 17-Ch ADC, 10-Bit PWM channels, I2C/SPI/USART connectivity. Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,021 parts In-Stock

1+ parts

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6,021

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 702 parts In-Stock

1+ parts

$15.349

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702

$15.349

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Aztec Data Supply Inc.

USA . 1,965 parts In-Stock

1+ parts

$28.082

100+ parts

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1,965

$28.082

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Corohmni

South Africa . 44 parts In-Stock

1+ parts

$38.622

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44

$38.622

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West Coast Incorporated

USA . 7,623 parts In-Stock

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7,623

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Microchip USA

USA . 2,626 parts In-Stock

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2,626

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Continental Prestige Electronics

USA . 2,349 parts In-Stock

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2,349

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QUARKTWIN TECHNOLOGY LTD

USA . 2,338 parts In-Stock

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2,338

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Argo Parts USA

USA . 1,628 parts In-Stock

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1,628

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock endless possibilities with the Microchip Technology PIC16F1946T-I/MR microcontroller. Known for its superior quality and reliability, this device offers a wide range of applications in various industries. Boasting a 16-bit architecture and an array of peripherals including PWM and ADC channels, this chip provides unparalleled value and flexibility to customers. Whether you're designing innovative IoT devices or enhancing industrial automation systems, the PIC16F1946T-I/MR is the perfect solution for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for different applications.

Address Bus Width: 8

Allows for efficient memory addressing and data transfer within the device.

Package Shape: SQUARE

Square package shape offers a compact form factor, ideal for space-constrained designs.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities for applications requiring higher performance.

Power Supplies (V): 2/5

Supports multiple power supply options, allowing for flexibility in design and integration.

No. of Terminals: 64

Ample number of terminals for connecting peripherals and external components, making it suitable for complex designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offers options for thermal management and space-saving in different applications.

Minimum Supply Voltage: 2.5 V

Works efficiently even at low supply voltages, ensuring reliable operation in diverse environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in harsh industrial environments.

CPU Family: PIC16

Part of the popular PIC16 family, known for their reliability and wide range of features for embedded applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good contact and solderability, enhancing the reliability of the connections.

ADC Channels: YES

Built-in analog-to-digital converters enable interfacing with analog sensors and signals, enhancing the device's versatility.

Terminal Position: QUAD

Quad terminal position allows for secure mounting on the PCB, ensuring mechanical stability.

ROM Words: 8192

Large ROM capacity provides ample storage for program code and data, accommodating complex applications.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1mm enables compact and slim device assemblies.

Width: 9 mm

Narrow width facilitates space-saving PCB layouts, contributing to overall system miniaturization.

Data EEPROM Size: 256

Large EEPROM size allows for non-volatile data storage, preserving critical information even during power loss.

External Data Bus Width: 8

Wider external data bus width enables faster data transfer rates between the microcontroller and external memory or peripherals.

Peripherals: BOD, COMPARATOR(3), LCD, POR, PWM(5), TIMER(5), WDT

Rich set of integrated peripherals offer enhanced functionality and flexibility for diverse application requirements.

Maximum Clock Frequency: 32 MHz

High clock frequency capability supports fast execution of instructions, ideal for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 40

Sufficient time at peak reflow temperature ensures proper soldering of the microcontroller during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering processes during PCB assembly.

Length: 9 mm

Compact length enables space-efficient PCB layout designs, saving board real estate in the overall system design.

Temperature Grade: INDUSTRIAL

Designed for industrial use, meeting stringent temperature and reliability requirements in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers efficient processing, low power consumption, and high performance for embedded applications.

RAM Bytes: 512

Ample RAM capacity supports efficient data storage and manipulation, enabling multitasking capability in the microcontroller.

Technology: CMOS

CMOS technology provides low power consumption, reducing energy requirements and enhancing battery life in portable devices.

Terminal Form: NO LEAD

No lead terminal form simplifies manufacturing processes and ensures environmental compliance with lead-free standards.

Analog To Digital Convertors: 17-Ch 10-Bit

Multiple analog-to-digital converters with high resolution allow for precise conversion of analog signals into digital data for accurate processing.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures reliable operation and compatibility with standard power sources.

PWM Channels: YES

Pulse-width modulation channels provide efficient control of analog devices, making the microcontroller suitable for motor control and power management applications.

Connectivity: I2C(2), SPI(2), USART(2)

Support for multiple communication interfaces enables seamless connectivity with external devices, expanding the possibilities for system integration and interactivity.

ROM Programmability: FLASH

Flash programmable ROM allows for easy reprogramming of code, facilitating firmware updates and customization without requiring specialized equipment.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables precise soldering and connection, ensuring reliable electrical contact and signal integrity.

Speed: 32 rpm

High processing speed of 32 rpm (rotations per minute) enables quick execution of instructions, enhancing overall system performance.

On Chip Program ROM Width: 14

Wide program ROM width of 14 bits allows for storing and executing complex program instructions efficiently within the microcontroller.

No. of I/O Lines: 54

Abundant I/O lines provide versatile connectivity options for interfacing with external devices and sensors, enhancing the microcontroller's functionality and flexibility in system design.

Technical Specifications

Microcontrollers PIC16F1946T-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

16

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

54

No. of Terminals:

64

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C(2), SPI(2), USART(2)

Peripherals:

BOD, COMPARATOR(3), LCD, POR, PWM(5), TIMER(5), WDT

Analog To Digital Convertors:

17-Ch 10-Bit

Trade Compliance

PIC16F1946T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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