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PIC16F18875T-I/ML

Microchip Technology

PIC16F18875T-I/ML by Microchip Technology

PIC16F18875T-I/ML by Microchip: 8-bit microcontroller, 32 MHz clock speed, 1024 RAM bytes. Ideal for industrial applications requiring low power mode, with peripherals like BOD, PWM(2), and USART(2) for connectivity.

Median Price

$2.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$2.240

100+ parts

-

1k+ parts

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10k+ parts

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94

$2.240

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-

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Vyrian

USA . 6,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,352

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Cyclops Electronics Ltd

UK . 130 parts In-Stock

1+ parts

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1k+ parts

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130

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 1,905 parts In-Stock

1+ parts

$2.240

100+ parts

-

1k+ parts

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10k+ parts

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1,905

$2.240

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Continental Prestige Electronics

USA . 769 parts In-Stock

1+ parts

$2.240

100+ parts

-

1k+ parts

-

10k+ parts

$2.195

769

$2.240

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-

$2.195

AZTECH Wire

Italy . 821 parts In-Stock

1+ parts

$18.357

100+ parts

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821

$18.357

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QualityLine Systems

Poland . 7,475 parts In-Stock

1+ parts

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7,475

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Marpe Global Electronics

Taiwan . 1,980 parts In-Stock

1+ parts

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1,980

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

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800

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XL Components Corporation

Australia . 661 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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661

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Overview

Unleash the power of innovation with the PIC16F18875T-I/ML by Microchip Technology. As pioneers in the field of microcontrollers, Microchip delivers top-notch quality and reliability. This versatile microcontroller opens up endless possibilities for applications, offering unmatched value and benefits to customers looking to take their projects to the next level. From industrial automation to consumer electronics, this product is the key to unlocking seamless performance and efficiency. Experience the difference with Microchip's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is lightweight and durable, making the product suitable for portable applications.

Surface Mount

YES - Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage

5.5 V - The higher supply voltage allows for flexibility in power supply options and compatibility with a variety of systems.

On Chip Data RAM Width

8 - Having a wide data RAM width enhances data processing speed and efficiency, making the product suitable for high-performance applications.

Screening Level

ISO/TS-16949 - This level of screening ensures high quality and reliability, making the product ideal for automotive and industrial applications.

Package Shape

SQUARE - The square shape of the package provides a compact and space-saving design, suitable for applications with limited space.

Bit Size

8 - The 8-bit size allows for fast and efficient data processing, making the product suitable for real-time applications.

DAC Channels

YES - The availability of DAC channels allows for accurate analog signal generation, making the product ideal for audio and sensor applications.

No. of Terminals

44 - Having a high number of terminals provides connectivity options and I/O flexibility, making the product versatile for various applications.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - The variety of package styles offers flexibility in circuit design and thermal management, making the product suitable for diverse applications.

Technical Specifications

Microcontrollers PIC16F18875T-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of I/O Lines:

36

No. of Serial I/Os:

1

No. of Terminals:

44

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

1024

RAM Words:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

ISO/TS-16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Current:

4.25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

USART(2), MSSP(2)

Peripherals:

BOD, COMPARATOR(2), POR, PWM(2), TIMER(7), WDT

Analog To Digital Convertors:

35-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F18875T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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