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PIC16F15325T-E/STVAO

Microchip Technology

PIC16F15325T-E/STVAO by Microchip Technology

PIC16F15325T-E/STVAO by Microchip Technology is a 32 MHz microcontroller with 1024 bytes of RAM and 8192 ROM words. It features 11-Ch 10-Bit ADC channels, 1-Ch 5-Bit DAC channels, and peripherals like BOD, POR, PWM(4), RTC, TIMER(3). Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40°C to 125°C.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,500 parts In-Stock

1+ parts

$1.510

100+ parts

$1.250

1k+ parts

$1.160

10k+ parts

$1.100

3,500

$1.510

$1.250

$1.160

$1.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,753 parts In-Stock

1+ parts

-

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-

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5,753

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,225 parts In-Stock

1+ parts

$1.280

100+ parts

$1.248

1k+ parts

$1.242

10k+ parts

-

3,225

$1.280

$1.248

$1.242

-

Ampacity Inc.

Singapore . 792 parts In-Stock

1+ parts

$1.280

100+ parts

-

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792

$1.280

-

-

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AZTECH Wire

Italy . 132 parts In-Stock

1+ parts

$8.700

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-

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132

$8.700

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Corohmni

South Africa . 15 parts In-Stock

1+ parts

$35.819

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15

$35.819

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-

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Aztec Data Supply Inc.

USA . 4,969 parts In-Stock

1+ parts

$36.110

100+ parts

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4,969

$36.110

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LOOK Integrated Logistics

Peru . 8,336 parts In-Stock

1+ parts

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8,336

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Montano Global Distributors

Canada . 7,097 parts In-Stock

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Continental Prestige Electronics

USA . 5,146 parts In-Stock

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Argo Parts USA

USA . 4,211 parts In-Stock

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4,211

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NIA Electronics

USA . 2,922 parts In-Stock

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2,922

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Ledger Components

France . 2,922 parts In-Stock

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2,922

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LMD Electronica

Estonia . 2,137 parts In-Stock

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2,137

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Microchip USA

USA . 1,798 parts In-Stock

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1,798

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Enhance your automotive applications with the Microchip Technology PIC16F15325T-E/STVAO microcontroller. With a focus on quality and reliability, Microchip Technology delivers cutting-edge solutions for your microcontroller needs. This product offers a wide range of features including DAC and ADC channels, low power mode, and a variety of peripherals to optimize performance. Trust in Microchip Technology to provide you with innovative solutions that exceed expectations and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Easy to mount on PCBs, saving space and making assembly easier.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of input voltage, increasing compatibility with different power sources.

On Chip Data RAM Width: 8

Ample RAM width for storing and processing data efficiently.

Screening Level: AEC-Q100; TS 16949

High-quality screening level ensures reliability and performance in automotive applications.

Package Shape: RECTANGULAR

Compact shape for space-saving designs.

DAC Channels: YES

Includes Digital-to-Analog Converters for smooth analog signal generation.

No. of Terminals: 14

Sufficient terminals for connecting to external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Sleek package style ideal for compact designs with limited space.

Minimum Supply Voltage: 2.5 V

Can operate efficiently at low power supply levels, ideal for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for applications in challenging environments.

CPU Family: PIC16

Part of a proven CPU family known for reliability and performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, expanding its range of use.

Terminal Finish: MATTE TIN

Provides a reliable finish for secure terminal connections.

ADC Channels: YES

Includes Analog-to-Digital Converters for precise digital signal conversion.

Terminal Position: DUAL

Dual terminal position for flexible PCB layout options.

ROM Words: 8192

Large ROM capacity for storing essential program information.

Maximum Seated Height: 1.2 mm

Low-profile design suitable for slim electronic devices.

Digital To Analog Convertors: 1-Ch 5-Bit

Offers a single-channel 5-bit DAC for analog output needs.

Width: 4.4 mm

Slim width for space-efficient PCB layout.

Data EEPROM Size: 224

Generous EEPROM size for non-volatile data storage.

Peripherals: BOD, BOR, COMPARATOR(2), POR, PWM(4), RTC, TIMER(3), WDT

Includes a wide range of peripherals for enhanced functionality.

Maximum Clock Frequency: 32 MHz

High clock frequency for swift data processing and operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures optimal reflow temperature for safe soldering processes.

Peak Reflow Temperature °C: 260

Handles peak reflow temperature for reliable solder joints.

Length: 5 mm

Compact length for space-efficient designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

High-performance RISC microcontroller for efficient data processing.

No. of Timers: 3

Multiple timers for scheduling and event management.

RAM Bytes: 1024

Ample RAM capacity for storing and processing data quickly.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed.

Terminal Form: GULL WING

Secure terminal form for reliable connections.

Analog To Digital Convertors: 11-Ch 10-Bit

Provides 11 channels of 10-bit ADC for precise analog-to-digital conversion.

Maximum Supply Current: 3.6 mA

Low supply current for energy efficiency.

Nominal Supply Voltage: 3 V

Suitable nominal voltage for stable operation.

No. of Serial I/Os: 2

Multiple serial I/O ports for communication with external devices.

PWM Channels: YES

Includes Pulse-Width Modulation channels for precise control over output signals.

Connectivity: EUSART(2), I2C

Offers connectivity through EUSART and I2C communication protocols.

ROM Programmability: FLASH

Flash ROM programmability for easy updates and modifications.

Terminal Pitch: 0.65 mm

Compact terminal pitch for efficient PCB layout.

Format: FIXED POINT

Utilizes fixed-point format for accurate mathematical calculations.

Speed: 32 rpm

Operates at a speed of 32 revolutions per minute.

Low Power Mode: YES

Includes a low power mode for energy-efficient operation.

On Chip Program ROM Width: 14

Ample ROM width for storing program instructions.

No. of I/O Lines: 12

Sufficient I/O lines for connecting to external peripherals.

Technical Specifications

Microcontrollers PIC16F15325T-E/STVAO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 2.3V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

2

No. of Terminals:

14

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Current:

3.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

224

Connectivity:

EUSART(2), I2C

Peripherals:

BOD, BOR, COMPARATOR(2), POR, PWM(4), RTC, TIMER(3), WDT

Analog To Digital Convertors:

11-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F15325T-E/STVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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