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MICRF009YM

Microchip Technology

MICRF009YM by Microchip Technology

MICRF009YM by Microchip Technology is a telecom interface IC with 16 terminals in a small outline package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a data rate of 0.002 Mbps and nominal voltage of 5V, ideal for telecom circuit applications.

Median Price

$3.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 726 parts In-Stock

1+ parts

$3.420

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726

$3.420

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Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$3.420

100+ parts

$3.270

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10k+ parts

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200

$3.420

$3.270

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.320

100+ parts

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50

$3.320

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 6,600 parts In-Stock

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6,600

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ComSIT Distribution GmbH

Germany . 192 parts In-Stock

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Euro-Tech

UK . 20 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 254 parts In-Stock

1+ parts

$2.910

100+ parts

$2.837

1k+ parts

$2.823

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254

$2.910

$2.837

$2.823

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Ampacity Inc.

Singapore . 29 parts In-Stock

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$2.910

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29

$2.910

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Continental Prestige Electronics

USA . 6,591 parts In-Stock

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$3.320

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$3.254

6,591

$3.320

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$3.254

Argo Parts USA

USA . 2,745 parts In-Stock

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$3.320

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AZTECH Wire

Italy . 330 parts In-Stock

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$8.683

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330

$8.683

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$9.235

100+ parts

$8.404

1k+ parts

$7.573

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500

$9.235

$8.404

$7.573

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Kepictronics

USA . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,615 parts In-Stock

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West Coast Incorporated

USA . 7,437 parts In-Stock

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7,437

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Assy Fe

Spain . 1,000 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$3.254

1k+ parts

$3.154

10k+ parts

$3.088

50

-

$3.254

$3.154

$3.088

Overview

Unleash the power of seamless connectivity with the MICRF009YM by Microchip Technology. This cutting-edge telecom interface IC boasts unparalleled quality and reliability, making it the go-to choice for a wide range of applications. From industrial automation to telecommunications, this versatile component offers unmatched value and performance, ensuring smooth operation in any scenario. Experience the advantages of Microchip Technology's expertise in every interaction with the MICRF009YM, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the telecom interface IC, making it suitable for long-term use in various conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the IC onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board, optimizing layout design and saving valuable board real estate.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common and stable range for many electronic devices, ensuring compatibility and ease of integration with other components.

Data Rate: 0.002 Mbps

The data rate of 0.002 Mbps is suitable for basic telecom interface functions, providing reliable data transmission without unnecessary complexity or potential for errors.

Technical Specifications

Other Function Telecom Interface ICs MICRF009YM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

Additional Features:

Operates from 4.75V to 5.5V

Data Rate:

.002 Mbps

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.895 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MICRF009YM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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