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MCP73863-I/ML

Microchip Technology

MCP73863-I/ML by Microchip Technology

MCP73863-I/ML by Microchip is a Power Management IC with 16 terminals in a square package. It operates b/w -40 to 85°C, supporting supply voltages from 4.5V to 12V. Ideal for industrial applications requiring power supply support circuits in compact form factors.

Median Price

$1.766

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$1.766

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35

$1.766

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Vyrian

USA . 3,099 parts In-Stock

1+ parts

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3,099

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,510 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

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1,510

$1.500

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Corohmni

South Africa . 722 parts In-Stock

1+ parts

$1.690

100+ parts

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722

$1.690

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Bastille Electronics

Australia . 93 parts In-Stock

1+ parts

$1.766

100+ parts

$1.678

1k+ parts

$1.594

10k+ parts

$1.572

93

$1.766

$1.678

$1.594

$1.572

Continental Prestige Electronics

USA . 2,958 parts In-Stock

1+ parts

$1.766

100+ parts

-

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$1.731

2,958

$1.766

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$1.731

Argo Parts USA

USA . 533 parts In-Stock

1+ parts

$1.766

100+ parts

-

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533

$1.766

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Semicontronic

India . 578 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

578

$3.500

$3.412

$3.395

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Aztec Data Supply Inc.

USA . 4,390 parts In-Stock

1+ parts

$4.944

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4,390

$4.944

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AZTECH Wire

Italy . 576 parts In-Stock

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$9.285

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576

$9.285

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Advanced Electronics

New Zealand . 76 parts In-Stock

1+ parts

$29.269

100+ parts

$26.635

1k+ parts

$24.001

10k+ parts

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76

$29.269

$26.635

$24.001

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GreenTree Electronics

Israel . 100,000 parts In-Stock

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100,000

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Kepictronics

USA . 30,530 parts In-Stock

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30,530

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Lixinc

USA . 18,533 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,371 parts In-Stock

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7,371

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Microchip USA

USA . 3,535 parts In-Stock

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3,535

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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West Coast Incorporated

USA . 1,191 parts In-Stock

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1,191

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Perfect Parts

USA . 1,123 parts In-Stock

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1,123

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Overview

Experience unparalleled power management with the MCP73863-I/ML by Microchip Technology. This high-quality Power Management IC is designed to provide efficient and reliable performance for a wide range of applications. From industrial settings to consumer electronics, this innovative product offers a compact design and advanced features that deliver exceptional value and benefits to our customers. Trust Microchip Technology to bring you cutting-edge solutions that meet your unique needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 4.5/12

Supports a wide range of power supply voltages, making it versatile and compatible with various applications.

No. of Terminals: 16

With a higher number of terminals, this IC offers more connection options and flexibility for different circuit designs.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles provide options for different mounting preferences and space constraints, making it adaptable to various design requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh operating conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature capability allows for usage in extreme cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte Tin finish provides good conductivity and corrosion resistance, ensuring stable connections for efficient power transfer.

Maximum Seated Height: 1 mm

Low seated height enables compact and space-saving designs, ideal for applications where size constraints are a concern.

Width (mm): 4 mm

Compact width makes for easy integration into tight spaces, allowing for more efficient use of PCB real estate.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply circuits, ensuring optimal performance and reliability for power management applications.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for compatibility with a wide range of power sources, making it versatile in different setups.

Length: 4 mm

Compact length facilitates space-efficient designs, especially useful in applications where board space is at a premium.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable operation in harsh industrial environments, making it suitable for rugged applications.

Maximum Supply Current (Isup): 4 mA

Low maximum supply current consumption helps in minimizing power consumption and heat generation, improving overall energy efficiency.

Terminal Form: NO LEAD

No lead terminals reduce the risk of lead contamination and are more environmentally friendly, complying with RoHS regulations.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on PCBs, enabling compact and space-saving designs.

Maximum Supply Voltage (Vsup): 12 V

High maximum supply voltage tolerance provides flexibility and compatibility with a wide range of power sources, ensuring versatility in various applications.

Technical Specifications

Power Management ICs MCP73863-I/ML attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

4.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

MCP73863-I/ML Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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