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MCP73862-I/ML

Microchip Technology

MCP73862-I/ML by Microchip Technology

MCP73862-I/ML by Microchip Technology is a Power Management IC with 16 terminals, operating temperature range of -40 to 85 °C. It supports power supplies from 4.5V to 12V and has a max supply current of 4mA. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

$1.012

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$2.000

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32

$2.000

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Vyrian

USA . 5,389 parts In-Stock

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5,389

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Cogito LLC

Ukraine . 2,002 parts In-Stock

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2,002

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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2,000

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Partservice

France . 237 parts In-Stock

1+ parts

-

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$0.944

1k+ parts

$0.915

10k+ parts

$0.915

237

-

$0.944

$0.915

$0.915

Micros sp.j. W. Kędra i J. Lic

Poland . 237 parts In-Stock

1+ parts

-

100+ parts

$1.012

1k+ parts

$0.980

10k+ parts

$0.980

237

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$1.012

$0.980

$0.980

Freelance Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 50 parts In-Stock

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$2.000

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50

$2.000

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Ampacity Inc.

Singapore . 975 parts In-Stock

1+ parts

$6.500

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975

$6.500

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Andel Nordic

Denmark . 3,034 parts In-Stock

1+ parts

$8.835

100+ parts

-

1k+ parts

$8.481

10k+ parts

$8.481

3,034

$8.835

-

$8.481

$8.481

AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$14.798

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256

$14.798

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Lixinc

USA . 17,938 parts In-Stock

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RGB Technical Solutions

Ukraine . 8,057 parts In-Stock

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8,057

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A-Z Elektronik GmbH

Germany . 5,070 parts In-Stock

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5,070

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Benley Electronics

USA . 1,911 parts In-Stock

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Microchip USA

USA . 445 parts In-Stock

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445

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Overview

Unlock the power of cutting-edge technology with the MCP73862-I/ML by Microchip Technology. This high-quality Power Management IC boasts a range of applications and benefits, providing customers with unparalleled value. From its durable plastic/epoxy construction to its sleek square package shape, this product is designed to exceed expectations. Experience the advantages of this innovative solution and elevate your projects to new heights with Microchip Technology's MCP73862-I/ML.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protects the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and labor during assembly.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it suitable for applications where board space is limited.

Power Supplies (V): 4.5/12

The wide range of power supply voltages supported (4.5V to 12V) makes this IC versatile and compatible with a variety of power sources.

No. of Terminals: 16

With 16 terminals, this IC offers a high level of connectivity options, allowing for flexible and customized circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the IC can withstand elevated temperatures and operate reliably in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the IC to function effectively in cold climates or industrial applications with extreme temperature variations.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good solderability and corrosion resistance, ensuring a secure and long-lasting electrical connection.

Width (mm): 4 mm

The compact width of 4mm allows for efficient space utilization on the PCB, enabling a higher component density and more streamlined layout.

Maximum Supply Current (Isup): 4 mA

The low maximum supply current of 4mA minimizes power consumption, making this IC energy-efficient and suitable for battery-operated devices.

Technical Specifications

Power Management ICs MCP73862-I/ML attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

4.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

8.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

MCP73862-I/ML Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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