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MCP47FVB22A1-E/ST

Microchip Technology

MCP47FVB22A1-E/ST by Microchip Technology

MCP47FVB22A1-E/ST by Microchip is a 12-bit D/A converter with 0.1465% linearity error, settling time of 6us, and low supply current of 0.7mA. Ideal for automotive applications due to its TS16949 screening level, operating temperature range from -40C to 125C, and small outline package style.

Median Price

$2.270

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

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35

$2.270

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Vyrian

USA . 265 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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265

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,559 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

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10k+ parts

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1,559

$1.800

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Corohmni

South Africa . 632 parts In-Stock

1+ parts

$2.125

100+ parts

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1k+ parts

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632

$2.125

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$2.225

100+ parts

-

1k+ parts

$2.136

10k+ parts

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50

$2.225

-

$2.136

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Continental Prestige Electronics

USA . 5,613 parts In-Stock

1+ parts

$2.270

100+ parts

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1k+ parts

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10k+ parts

$2.225

5,613

$2.270

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-

$2.225

Argo Parts USA

USA . 3,477 parts In-Stock

1+ parts

$2.270

100+ parts

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1k+ parts

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3,477

$2.270

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.285

100+ parts

$2.285

1k+ parts

$2.285

10k+ parts

-

5,000

$2.285

$2.285

$2.285

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Semicontronic

India . 1,629 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

10k+ parts

-

1,629

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 710 parts In-Stock

1+ parts

$5.458

100+ parts

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710

$5.458

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Aztec Data Supply Inc.

USA . 3,687 parts In-Stock

1+ parts

$9.100

100+ parts

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1k+ parts

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3,687

$9.100

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Ampacity Inc.

Singapore . 532 parts In-Stock

1+ parts

$16.000

100+ parts

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1k+ parts

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532

$16.000

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QUARKTWIN TECHNOLOGY LTD

USA . 12,305 parts In-Stock

1+ parts

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12,305

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QualityLine Systems

Poland . 8,237 parts In-Stock

1+ parts

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8,237

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XL Components Corporation

Australia . 575 parts In-Stock

1+ parts

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575

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Marpe Global Electronics

Taiwan . 362 parts In-Stock

1+ parts

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100+ parts

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362

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Overview

Experience unparalleled precision and performance with the MCP47FVB22A1-E/ST from Microchip Technology, a leading manufacturer in the industry. As a top-of-the-line Digital-to-Analog Converter, this product is designed to deliver exceptional quality and reliability for a wide range of applications. With its advanced features and cutting-edge technology, customers can expect seamless integration, fast settling times, and precise outputs. Trust in Microchip Technology to provide you with the best-in-class solutions for all your digital-to-analog conversion needs. Elevate your projects with the MCP47FVB22A1-E/ST today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the product onto a PCB, saving time and effort during assembly.

Screening Level: TS 16949

The TS 16949 screening level ensures that the product meets strict quality standards, guaranteeing reliable performance and long-term durability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a PCB, making it ideal for designs with limited board real estate.

No. of Bits: 12

With 12 bits of resolution, this product provides high precision and accuracy in converting digital signals to analog, resulting in superior output quality.

Maximum Linearity Error (EL): 0.1465 %

The low maximum linearity error of 0.1465% ensures that the output signal closely matches the input digital signal, minimizing distortion and ensuring accurate conversion.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for easy integration into various circuit designs and configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product space-efficient and suitable for compact device designs.

Nominal Settling Time (tstl): 6 us

The fast nominal settling time of 6 us ensures rapid response and stable output voltage, making it suitable for real-time applications that require quick signal conversions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to withstand extreme environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments, expanding the product's usability in various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing the product's reliability and longevity.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, making it easier to integrate the product into different circuit layouts.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm minimizes the space required for the product on a PCB, making it suitable for compact device designs.

Width: 3 mm

The narrow width of 3 mm makes the product suitable for applications with limited board space, allowing for efficient use of PCB real estate.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time of 40 seconds at peak reflow temperature ensures proper soldering of the product during assembly, preventing damage and ensuring reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering of the product onto a PCB, ensuring secure electrical connections.

Length: 4.4 mm

The compact length of 4.4 mm makes the product suitable for applications with size constraints, allowing for efficient use of board space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can withstand harsh environments and temperature fluctuations, making it ideal for automotive applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, enhancing the reliability and durability of the product.

Maximum Supply Current: 0.7 mA

The low maximum supply current of 0.7 mA ensures minimal power consumption, making the product energy-efficient and suitable for battery-powered devices.

Input Format: SERIAL

The serial input format allows for easy integration with microcontrollers and other digital devices, enabling seamless communication and control.

Converter Type: D/A CONVERTER

The digital-to-analog converter type ensures accurate conversion of digital signals to analog, making the product ideal for various audio and control applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting of the product on a PCB, making it suitable for designs with limited space.

Input Bit Code: BINARY

The binary input bit code provides a simple and efficient way to input digital signals, ensuring compatibility with a wide range of digital systems.

Technical Specifications

Digital-to-Analog Converters MCP47FVB22A1-E/ST attributes and parameters. Explore more Digital-to-Analog Converters devices from Microchip Technology

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1465 %

Nominal Settling Time (tstl):

6 µs

Maximum Supply Current:

700 μA

No. of Bits:

12

No. of Functions:

1

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.25

Standards and Codes

Screening Level:

TS 16949

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Trade Compliance

MCP47FVB22A1-E/ST Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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