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MCP37D31-200E/TE

Microchip Technology

MCP37D31-200E/TE by Microchip Technology

MCP37D31-200E/TE by Microchip: 16-bit ADC with 8 analog channels, 200 MHz sample rate. Automotive grade for AEC-Q100 applications. Package: Grid Array, Thin Profile, Fine Pitch; operates from -40 to 125°C.

Median Price

$51.570

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 159 parts In-Stock

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$51.570

100+ parts

$39.070

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159

$51.570

$39.070

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$130.080

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10

$130.080

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Vyrian

USA . 7,888 parts In-Stock

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7,888

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Distributors (Availability)

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AZTECH Wire

Italy . 631 parts In-Stock

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$11.922

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631

$11.922

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Ampacity Inc.

Singapore . 291 parts In-Stock

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$43.830

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291

$43.830

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Continental Prestige Electronics

USA . 6,819 parts In-Stock

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$130.080

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$127.478

6,819

$130.080

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$127.478

Netroflash

USA . 50 parts In-Stock

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$130.080

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$127.478

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50

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$127.478

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Vigor

Singapore . 348 parts In-Stock

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$141.700

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348

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RGB Technical Solutions

Ukraine . 6,395 parts In-Stock

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6,395

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 1,214 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the MCP37D31-200E/TE by Microchip Technology. This state-of-the-art ADC boasts unmatched quality and reliability, making it a top choice for automotive applications. With 8 analog input channels and a lightning-fast sample rate of 200 MHz, this converter offers precise data acquisition with minimal power consumption. Trust in Microchip's expertise to deliver cutting-edge technology that exceeds expectations. Experience seamless integration and superior performance with the MCP37D31-200E/TE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliable performance in various environments.

No. of Analog In Channels: 8

Allows for multiple input signals to be processed simultaneously, increasing efficiency and flexibility.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying assembly processes.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

No. of Bits: 16

Provides high resolution for accurate conversion of analog signals to digital data.

No. of Terminals: 121

Offers a sufficient number of terminals for connecting to other components and interfaces.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Facilitates efficient signal routing and connectivity in compact electronic devices.

Maximum Operating Temperature: 125 °C

Ensures stable performance even in high-temperature environments, increasing the versatility of the product.

Minimum Operating Temperature: -40 °C

Allows the product to function reliably in cold conditions, making it suitable for a wide range of operating environments.

Terminal Position: BOTTOM

Facilitates easy mounting and soldering onto circuit boards, enhancing the product's ease of use.

Maximum Conversion Time: 0.025 us

Enables rapid conversion of analog signals to digital data, ideal for applications requiring real-time processing.

Maximum Seated Height: 1.08 mm

Has a low profile design that helps in space-constrained applications, allowing for compact device designs.

Width: 8 mm

Compact size makes it suitable for integration into smaller electronic devices.

Length: 8 mm

Compact size makes it suitable for integration into smaller electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to withstand the demanding conditions in automotive applications, ensuring reliability and performance.

Maximum Analog Input Voltage: 4.46 V

Supports a wide range of input voltages, making it versatile for different analog signal sources.

Sample Rate: 200 MHz

High sampling rate enables rapid capture of input signals, ideal for applications requiring high-speed data acquisition.

Terminal Form: BALL

Ball terminals provide secure connections and easy soldering, enhancing the product's reliability and ease of installation.

Maximum Supply Current: 300 mA

Efficient power consumption helps in reducing overall power requirements for the system.

Converter Type: ADC, FLASH METHOD

Flash method ensures fast and efficient analog-to-digital conversion, suitable for real-time applications.

Nominal Supply Voltage: 1.2 V

Low supply voltage requirement helps in reducing power consumption and heat dissipation.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Offers flexibility in output data formats, allowing compatibility with different systems and applications.

Terminal Pitch: 0.65 mm

Fine pitch allows for closer spacing of terminals, enabling compact and efficient circuit board designs.

Minimum Analog Input Voltage: -4.46 V

Supports a wide range of input voltages, making it versatile for different analog signal sources.

Output Format: SERIAL, PARALLEL, WORD

Multiple output formats provide compatibility with various systems and interfaces.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold function ensures accurate sampling of analog signals, enhancing the precision of digital conversion.

Technical Specifications

Analog-to-Digital Converters MCP37D31-200E/TE attributes and parameters. Explore more Analog-to-Digital Converters devices from Microchip Technology

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Sample Rate:

200 MHz

Hold Mode:

Sample

Maximum Conversion Time:

25 ns

Electrical Specifications

Minimum Analog Input Voltage:

-4.46 V

Maximum Analog Input Voltage:

4.46 V

Nominal Supply Voltage:

1.2 V

Maximum Supply Current:

300 mA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Bottom

No. of Terminals:

121

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.043 in (1.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA121,11X11,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B121

Screening Level:

AEC-Q100

Trade Compliance

MCP37D31-200E/TE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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