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MCP37D21-80E/TE

Microchip Technology

MCP37D21-80E/TE by Microchip Technology

MCP37D21-80E/TE by Microchip: 14-bit ADC with 8 channels, 80 MHz sample rate, and automotive-grade temp. Ideal for high-speed data acquisition in automotive applications. Features include thin profile package, 121 terminals, and low supply current of 173 mA.

Median Price

$31.114

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$5.281

100+ parts

-

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10

$5.281

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Newark

USA . 10 parts In-Stock

1+ parts

$12.910

100+ parts

$12.910

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10

$12.910

$12.910

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Verical

USA . 10 parts In-Stock

1+ parts

$29.528

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10

$29.528

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Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$32.700

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10

$32.700

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Mouser Electronics

USA . 83 parts In-Stock

1+ parts

$33.510

100+ parts

$27.950

1k+ parts

$25.410

10k+ parts

$25.400

83

$33.510

$27.950

$25.410

$25.400

DigiKey

USA . 3 parts In-Stock

1+ parts

$33.510

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3

$33.510

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$41.860

100+ parts

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150

$41.860

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TME

Poland . 10 parts In-Stock

1+ parts

$43.240

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10

$43.240

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Vyrian

USA . 3,560 parts In-Stock

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3,560

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Distributors (Availability)

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Ampacity Inc.

Singapore . 35 parts In-Stock

1+ parts

$10.970

100+ parts

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35

$10.970

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AZTECH Wire

Italy . 681 parts In-Stock

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$18.332

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681

$18.332

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Continental Prestige Electronics

USA . 6 parts In-Stock

1+ parts

$34.480

100+ parts

$26.600

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6

$34.480

$26.600

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Argo Parts USA

USA . 4,754 parts In-Stock

1+ parts

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4,754

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Fulton Briggs Corp.

USA . 1,821 parts In-Stock

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1,821

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Vigor

Singapore . 448 parts In-Stock

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448

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Overview

Revolutionize your analog-to-digital conversion with the MCP37D21-80E/TE by Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability in all their products. With 8 analog input channels and a blazing fast sample rate of 80 MHz, this converter is perfect for automotive applications where precision and speed are critical. Say goodbye to slow conversion times and hello to accurate results with the MCP37D21-80E/TE. Unlock the power of high-performance ADC technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the components inside, making the product reliable for long-term use.

No. of Analog In Channels: 8

Having 8 analog input channels allows for multiple inputs to be converted simultaneously, increasing efficiency and flexibility in data acquisition.

Surface Mount: YES

Surface mount technology makes it easy to mount and integrate the converter onto a PCB, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards ensures the product's reliability and performance in automotive applications, making it suitable for harsh environments.

No. of Bits: 14

With 14 bits resolution, the converter can provide high accuracy and precision in converting analog signals to digital data, making it suitable for applications requiring fine details.

No. of Terminals: 121

Having numerous terminals allows for easy connection and integration of the converter into a circuit, providing flexibility and ease of use.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package with thin profile and fine pitch design offers high density and space-saving benefits, ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the converter can withstand elevated temperatures in automotive and industrial applications without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the converter to function effectively in cold environments, providing versatility in various operating conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering, enhancing the ease of integration and maintenance of the product.

Maximum Conversion Time: 0.0125 us

The fast conversion time ensures quick and efficient analog-to-digital conversion, enabling real-time data processing and high-speed applications.

Maximum Seated Height: 1.08 mm

The low seated height makes the converter suitable for slim and compact electronic designs, allowing for space-efficient integration.

Width: 8 mm

With a compact width dimension, the converter can fit into tight spaces or cramped layouts, enabling versatile use in various electronic devices.

Length: 8 mm

The small length size contributes to the overall compact form factor of the converter, making it suitable for applications with limited space constraints.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures that the converter meets stringent quality and reliability standards for use in automotive applications, where durability and performance are critical.

Maximum Analog Input Voltage: 4.46 V

Supporting a high maximum analog input voltage range allows for compatibility with a wide range of signal levels, making the converter versatile for different applications.

Sample Rate: 80 MHz

The high sample rate capability enables fast data acquisition and processing, enhancing the efficiency and speed of data conversion in high-frequency applications.

Terminal Form: BALL

Having ball terminal form simplifies the soldering process and ensures secure connections, enhancing the reliability and ease of assembly of the product.

Maximum Supply Current: 173 mA

The moderate maximum supply current requirement ensures efficient power consumption, making the converter energy-efficient and suitable for battery-powered devices.

Converter Type: ADC, PIPELINED

The pipelined ADC design offers high-speed conversion and low latency, making it suitable for applications requiring fast and continuous data processing.

Nominal Supply Voltage: 1.2 V

Operating at a low nominal supply voltage offers energy efficiency and compatibility with low-power devices, making the converter suitable for a wide range of applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Supporting multiple output bit code formats provides flexibility in data representation, allowing compatibility with different systems and simplifying data processing.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on a PCB, saving space and facilitating compact designs for electronic products.

Minimum Analog Input Voltage: -4.46 V

Supporting a wide range of analog input voltages, including negative values, makes the converter versatile for applications with bipolar signal requirements.

Output Format: PARALLEL, WORD

The parallel output format in word configuration offers efficient data transmission and compatibility with a variety of systems, simplifying integration and data processing.

Sample and Hold/Track and Hold: SAMPLE

Incorporating sample and hold functionality enhances the accuracy of the conversion process by maintaining stable input signals, ensuring precise and reliable digital outputs.

Technical Specifications

Analog-to-Digital Converters MCP37D21-80E/TE attributes and parameters. Explore more Analog-to-Digital Converters devices from Microchip Technology

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Sample Rate:

80 MHz

Hold Mode:

Sample

Maximum Conversion Time:

12.5 ns

Electrical Specifications

Minimum Analog Input Voltage:

-4.46 V

Maximum Analog Input Voltage:

4.46 V

Nominal Supply Voltage:

1.2 V

Maximum Supply Current:

173 mA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Bottom

No. of Terminals:

121

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.043 in (1.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA121,11X11,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B121

Screening Level:

AEC-Q100

Trade Compliance

MCP37D21-80E/TE Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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