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MCP3301T-BI/SN

Microchip Technology

MCP3301T-BI/SN by Microchip Technology

MCP3301T-BI/SN by Microchip Tech is a 13-bit ADC with 2 analog in channels, operating at -40 to 85°C. Ideal for industrial applications, it offers a sample rate of 0.1 MHz and supports a max analog input voltage of ±5V. With a low supply current of 0.45mA, this small outline package converter is suitable for various precision measurement systems.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,300 parts In-Stock

1+ parts

$3.680

100+ parts

$3.642

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3,300

$3.680

$3.642

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.300

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500

$4.300

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Vyrian

USA . 6,225 parts In-Stock

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6,225

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Martec Srl

Italy . 990 parts In-Stock

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990

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ComSIT Distribution GmbH

Germany . 743 parts In-Stock

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743

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Distributors (Availability)

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Vigor

Singapore . 1,523 parts In-Stock

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$2.440

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1,523

$2.440

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Ampacity Inc.

Singapore . 100 parts In-Stock

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$3.130

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100

$3.130

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Continental Prestige Electronics

USA . 2,152 parts In-Stock

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$4.300

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$4.214

2,152

$4.300

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$4.214

Argo Parts USA

USA . 1,355 parts In-Stock

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$4.300

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1,355

$4.300

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AZTECH Wire

Italy . 288 parts In-Stock

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$10.748

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288

$10.748

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Corohmni

South Africa . 82 parts In-Stock

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$17.038

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82

$17.038

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Aztec Data Supply Inc.

USA . 87 parts In-Stock

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$24.360

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87

$24.360

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Lixinc

USA . 18,258 parts In-Stock

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18,258

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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RGB Technical Solutions

Ukraine . 3,967 parts In-Stock

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3,967

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$4.214

1k+ parts

$4.085

10k+ parts

$3.999

500

-

$4.214

$4.085

$3.999

Overview

Unlock the power of precise analog-to-digital conversion with the MCP3301T-BI/SN from Microchip Technology. This high-quality converter offers unmatched accuracy and reliability, making it ideal for a wide range of industrial applications. With its compact size, low power consumption, and industrial-grade temperature range, this device delivers exceptional value to customers looking for top-tier performance. Trust Microchip Technology to provide cutting-edge solutions for your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for housing the analog-to-digital converter.

No. of Analog In Channels: 2

Allows for conversion of two analog signals simultaneously, increasing efficiency.

No. of Bits: 13

Provides a high resolution for accurate digital conversion of analog signals.

Maximum Linearity Error (EL): 0.012207 %

Ensures precision and accuracy in the conversion process.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where a wide range of temperatures may be encountered.

Sample Rate: 0.1 MHz

Offers a high sampling rate for capturing fast-changing analog signals.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes a high-speed and accurate conversion method for reliable performance.

Technical Specifications

Analog-to-Digital Converters MCP3301T-BI/SN attributes and parameters. Explore more Analog-to-Digital Converters devices from Microchip Technology

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

13

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.012207 %

Sample Rate:

100 kHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-5 V

Maximum Analog Input Voltage:

5 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

450 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.23

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e3

Screening Level:

TS 16949

Trade Compliance

MCP3301T-BI/SN Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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