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MCP2557FDT-H/SN

Microchip Technology

MCP2557FDT-H/SN by Microchip Technology

MCP2557FDT-H/SN by Microchip: CAN FD transceiver for automotive applications. Features 8 Mbps data rate, 5V supply voltage, and TS16949 screening level. Small outline package with dual terminals, operating from -40 to 150°C.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.740

100+ parts

-

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50

$0.740

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Chip Stock

USA . 28,500 parts In-Stock

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28,500

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Vyrian

USA . 5,276 parts In-Stock

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5,276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,548 parts In-Stock

1+ parts

$0.630

100+ parts

-

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2,548

$0.630

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Continental Prestige Electronics

USA . 3,553 parts In-Stock

1+ parts

$0.740

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$0.725

3,553

$0.740

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$0.725

Argo Parts USA

USA . 2,319 parts In-Stock

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$0.740

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2,319

$0.740

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Ampacity Inc.

Singapore . 13,973 parts In-Stock

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$0.900

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13,973

$0.900

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Semicontronic

India . 10,218 parts In-Stock

1+ parts

$0.900

100+ parts

$0.878

1k+ parts

$0.873

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10,218

$0.900

$0.878

$0.873

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Aztec Data Supply Inc.

USA . 4,155 parts In-Stock

1+ parts

$9.030

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4,155

$9.030

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Corohmni

South Africa . 854 parts In-Stock

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$9.471

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854

$9.471

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AZTECH Wire

Italy . 329 parts In-Stock

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$20.620

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329

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Futuretech Components

Singapore . 12,000 parts In-Stock

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Fulton Briggs Corp.

USA . 6,351 parts In-Stock

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Lixinc

USA . 5,581 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,267 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

1+ parts

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$0.725

1k+ parts

$0.703

10k+ parts

$0.688

100

-

$0.725

$0.703

$0.688

Overview

Enhance your automotive networking solutions with the MCP2557FDT-H/SN by Microchip Technology. This CAN FD transceiver offers unparalleled quality and reliability, thanks to Microchip's TS 16949 screening level. With a data rate of 8 Mbps and a nominal supply voltage of 5V, this small outline package is perfect for a wide range of applications in the automotive industry. Trust in Microchip Technology to provide you with cutting-edge network interfaces that deliver unmatched performance and value. Upgrade your networking capabilities today with the MCP2557FDT-H/SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for use in automotive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, meeting automotive industry standards.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable performance in extreme conditions, making it suitable for automotive environments.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides good conductivity and solderability, ensuring stable connections for data transmission.

Terminal Position: DUAL

Dual terminal position allows for secure and stable mounting on PCBs, minimizing the risk of disconnection or signal interference.

Width: 3.9 mm

Compact width of 3.9 mm saves space on PCBs, making it suitable for applications where board real estate is limited.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures durability and reliability in harsh operating conditions commonly found in automotive environments.

Data Rate: 8 Mbps

High data rate of 8 Mbps allows for fast and efficient data transmission, making it suitable for high-speed communication applications.

Technical Specifications

Network Interfaces MCP2557FDT-H/SN attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

8 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MCP2557FDT-H/SN Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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