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MCP23009-E/SO

Microchip Technology

MCP23009-E/SO by Microchip Technology

MCP23009-E/SO by Microchip Technology is an 8-bit parallel I/O port with a max supply voltage of 5.5V and operating temperature range from -40 to 125°C. Ideal for automotive applications, it features a small outline package style, dual terminal position, and Gull Wing terminal form for versatile integration in various systems.

Median Price

$1.520

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 11,054 parts In-Stock

1+ parts

$1.520

100+ parts

$1.150

1k+ parts

$1.120

10k+ parts

$1.110

11,054

$1.520

$1.150

$1.120

$1.110

DigiKey

USA . 448 parts In-Stock

1+ parts

$1.520

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$1.150

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448

$1.520

$1.150

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Mouser Electronics

USA . 272 parts In-Stock

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$1.520

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$1.150

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272

$1.520

$1.150

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Arrow

USA . 5,985 parts In-Stock

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$1.155

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5,985

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$1.155

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Verical

USA . 5,964 parts In-Stock

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$1.399

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5,964

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$1.399

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Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 419 parts In-Stock

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Schukat

Germany . 114 parts In-Stock

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$1.304

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114

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$1.304

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Distributors (Availability)

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Corohmni

South Africa . 1,194 parts In-Stock

1+ parts

$1.180

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$1.180

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Vigor

Singapore . 145 parts In-Stock

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$1.190

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145

$1.190

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QUARKTWIN TECHNOLOGY LTD

USA . 26,535 parts In-Stock

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26,535

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Lixinc

USA . 8,623 parts In-Stock

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8,623

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West Coast Incorporated

USA . 7,984 parts In-Stock

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7,984

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 1,020 parts In-Stock

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Perfect Parts

USA . 949 parts In-Stock

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949

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Kepictronics

USA . 447 parts In-Stock

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447

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Cyclops Electronics Ltd (Excess)

UK . 419 parts In-Stock

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419

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Overview

Elevate your projects with the MCP23009-E/SO from Microchip Technology, a leading innovator in the industry. Designed for parallel I/O ports, this high-quality product offers versatile applications and seamless integration. With a focus on value and reliability, customers can expect top-notch performance and unmatched benefits. Experience efficiency, precision, and convenience with the MCP23009-E/SO – the perfect solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package.

Surface Mount: YES

Allows for easy installation on a circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for different applications.

Screening Level: TS 16949

Compliance with TS 16949 ensures high quality and reliability in automotive applications.

No. of Bits: 8

Provides 8 bits of parallel I/O data, suitable for various input/output tasks.

Power Supplies (V): 2/5

Supports dual power supply options, allowing flexibility in power configurations.

No. of Terminals: 18

Offers a sufficient number of terminals for connectivity and data transfer.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space and is ideal for applications with size constraints.

Minimum Supply Voltage: 1.8 V

Allows operation at low supply voltages, suitable for energy-efficient applications.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes it suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures performance in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows flexible mounting options on PCBs.

Maximum Seated Height: 2.65 mm

Low profile design minimizes board space and enables compact systems.

Width: 7.5 mm

Narrow width allows for efficient use of board space.

Maximum Clock Frequency: 10 MHz

Supports high-speed data transfer and processing.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints during assembly.

Length: 11.55 mm

Compact length for space-saving designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability in automotive applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port for versatile use in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for surface mount soldering and secure connections.

Maximum Supply Current: 1 mA

Low supply current requirement for efficient power consumption.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with common power sources.

Terminal Pitch: 1.27 mm

Standard 1.27mm terminal pitch for compatibility with typical PCB layouts.

No. of I/O Lines: 8

8 I/O lines offer flexibility for connecting to external devices and peripherals.

Technical Specifications

Parallel I/O Ports MCP23009-E/SO attributes and parameters. Explore more Parallel I/O Ports devices from Microchip Technology

Specs

Maximum Clock Frequency:

10 MHz

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

MCP23009-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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