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MCP2003B-E/MF

Microchip Technology

MCP2003B-E/MF by Microchip Technology

MCP2003B-E/MF by Microchip Tech is a LIN transceiver with 8 terminals, operating temp range of -40 to 125°C. It's a small outline package suitable for network interfaces in automotive applications. Features matte tin finish, dual terminal position, and very thin profile design.

Median Price

$0.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 14,070 parts In-Stock

1+ parts

$0.950

100+ parts

$0.720

1k+ parts

$0.700

10k+ parts

-

14,070

$0.950

$0.720

$0.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 11,880 parts In-Stock

1+ parts

$0.940

100+ parts

$0.850

1k+ parts

$0.760

10k+ parts

-

11,880

$0.940

$0.850

$0.760

-

Vyrian

USA . 8,256 parts In-Stock

1+ parts

-

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-

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8,256

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Nova Conductors

Japan . 1,000 parts In-Stock

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-

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1,000

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 14,805 parts In-Stock

1+ parts

$0.810

100+ parts

$0.790

1k+ parts

$0.786

10k+ parts

-

14,805

$0.810

$0.790

$0.786

-

AZTECH Wire

Italy . 827 parts In-Stock

1+ parts

$8.150

100+ parts

-

1k+ parts

-

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827

$8.150

-

-

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$8.632

100+ parts

$8.201

1k+ parts

$8.201

10k+ parts

-

650

$8.632

$8.201

$8.201

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Corohmni

South Africa . 189 parts In-Stock

1+ parts

$8.963

100+ parts

-

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10k+ parts

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189

$8.963

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-

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Aztec Data Supply Inc.

USA . 2,822 parts In-Stock

1+ parts

$9.190

100+ parts

-

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2,822

$9.190

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Ampacity Inc.

Singapore . 1,615 parts In-Stock

1+ parts

$724.000

100+ parts

-

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1,615

$724.000

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-

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Continental Prestige Electronics

USA . 6,090 parts In-Stock

1+ parts

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6,090

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Fulton Briggs Corp.

USA . 3,104 parts In-Stock

1+ parts

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3,104

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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450

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Argo Parts USA

USA . 285 parts In-Stock

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285

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Overview

Enhance your network interfaces with the MCP2003B-E/MF from Microchip Technology, a reliable and high-quality solution for various applications. With a focus on innovation and performance, Microchip Technology delivers cutting-edge products that provide seamless connectivity and functionality. The MCP2003B-E/MF offers customers unparalleled value, benefits, and advantages, ensuring optimal performance and efficiency in any project. Upgrade your network interfaces today and experience the difference with Microchip Technology.

Feature Benefit Bullets

Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it a reliable choice for various applications.

Surface Mount: YES

With the ability to be surface mounted, this network interface offers easy installation and space-saving benefits in compact electronic devices.

Screening Level: TS 16949

Adhering to TS 16949 screening level standards ensures high quality and reliability, making this product suitable for demanding industrial environments.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for efficient use of space and easy integration into circuit layouts.

No. of Terminals: 8

With eight terminals, this network interface offers versatile connectivity options for different devices and configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances thermal performance and overall efficiency in operation.

Operating Temperature: -40 °C to 125 °C

The wide operating temperature range ensures reliable performance in extreme temperature conditions, making it suitable for various environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit board design and allow for secure connections, enhancing overall functionality.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile and compact design, making this network interface suitable for space-constrained applications.

Width: 3 mm

The 3mm width provides a compact footprint, making it ideal for small electronic devices where space is limited.

Length: 3 mm

The 3mm length ensures a compact size, allowing for easy integration into various electronic systems without taking up much space.

Terminal Form: NO LEAD

The no lead terminal form improves environmental friendliness and makes disposal easier, contributing to a greener product design.

Telecom IC Type: LIN TRANSCEIVER

With a LIN transceiver type, this network interface enables efficient communication in automotive and industrial applications, making it a versatile choice for various industries.

Nominal Supply Voltage: 12 V

The 12V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems hassle-free.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for high-density mounting, offering increased connectivity options in compact electronic designs.

Technical Specifications

Network Interfaces MCP2003B-E/MF attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MCP2003B-E/MF Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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