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MCP112T-290E/LB

Microchip Technology

MCP112T-290E/LB by Microchip Technology

MCP112T-290E/LB by Microchip Technology is a Power Management IC with 1/5.5V power supplies, +2.9V nominal threshold voltage, and -40 to 125°C operating temperature range. Ideal for automotive applications, this IC features TS 16949 screening level and small outline package style for power supply support circuits in compact designs.

Median Price

$0.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,750 parts In-Stock

1+ parts

$0.600

100+ parts

$0.460

1k+ parts

-

10k+ parts

-

2,750

$0.600

$0.460

-

-

DigiKey

USA . 1,327 parts In-Stock

1+ parts

$0.600

100+ parts

$0.460

1k+ parts

-

10k+ parts

$0.460

1,327

$0.600

$0.460

-

$0.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 33,000 parts In-Stock

1+ parts

$0.350

100+ parts

$0.320

1k+ parts

$0.290

10k+ parts

-

33,000

$0.350

$0.320

$0.290

-

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$0.460

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$0.460

-

-

-

Vyrian

USA . 4,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,233

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.460

100+ parts

-

1k+ parts

$0.437

10k+ parts

$0.428

50

$0.460

-

$0.437

$0.428

Vigor

Singapore . 2,933 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

10k+ parts

-

2,933

$0.470

-

-

-

Fulton Briggs Corp.

USA . 7,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,715

-

-

-

-

Overview

Unlock the power of reliable and efficient power management with the Microchip Technology MCP112T-290E/LB. Manufactured by industry leader Microchip Technology, this Power Management IC offers unparalleled quality and performance in a compact package. Ideal for automotive applications, this IC ensures stable power supplies with a wide operating temperature range from -40°C to 125°C. Experience peace of mind knowing your systems are running smoothly with the MCP112T-290E/LB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, making it suitable for various applications.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Screening Level: TS 16949

Ensures high quality and reliability of the product, meeting automotive industry standards.

Package Shape: RECTANGULAR

Enables compact and efficient design integration in electronic systems.

Power Supplies (V): 1/5.5

Supports a wide voltage range, allowing flexibility in power requirements for different applications.

No. of Terminals: 3

Provides necessary connectivity for the IC to function effectively within a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enhances space-saving and efficiency in circuit board layout and design.

Maximum Operating Temperature: 125 °C

Ensures reliable operation in high-temperature environments, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Allows the IC to function properly in extreme cold conditions, increasing its versatility.

Terminal Finish: Matte Tin (Sn)

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Terminal Position: DUAL

Facilitates proper connection within the circuit, improving overall functionality and efficiency.

Maximum Seated Height: 1.1 mm

Ensures a low-profile design, making it suitable for compact electronic devices.

Width (mm): 1.25 mm

Contributes to the compact and space-saving design of the IC, ideal for small electronic systems.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically to support power supply functions, ensuring stable and reliable power delivery.

Minimum Supply Voltage (Vsup): 1 V

Allows the IC to operate efficiently even at low supply voltages, increasing its versatility.

Maximum Time At Peak Reflow Temperature (s): 40

Indicates the durability of the IC during reflow soldering processes, ensuring reliable performance.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing, ensuring proper soldering and connection.

Length: 2.025 mm

Contributes to the compact size and space-saving design of the IC, suitable for small electronic devices.

Nominal Threshold Voltage (V): +2.9V

Specifies the threshold voltage for the IC, ensuring stable and accurate performance in power management.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature range, ensuring reliability in automotive applications.

Maximum Supply Current (Isup): 0.00175 mA

Indicates low power consumption of the IC, contributing to energy efficiency and longer battery life.

Terminal Form: GULL WING

Facilitates easy soldering and connection of the IC to the circuit board, ensuring proper functionality.

Terminal Pitch: 0.65 mm

Provides proper spacing for terminals, enhancing connectivity and reliability within the circuit.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of supply voltages, making it versatile for different power supply requirements.

Technical Specifications

Power Management ICs MCP112T-290E/LB attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.025 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP3,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.00175 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.9V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.25 mm

Trade Compliance

MCP112T-290E/LB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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