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LAN9255-I/ZMX020

Microchip Technology

LAN9255-I/ZMX020 by Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE; Technology: CMOS;

Median Price

$19.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 31 parts In-Stock

1+ parts

$15.410

100+ parts

$13.690

1k+ parts

-

10k+ parts

-

31

$15.410

$13.690

-

-

Microchip Technology

USA . 1,710 parts In-Stock

1+ parts

$19.270

100+ parts

$14.610

1k+ parts

$13.500

10k+ parts

$12.800

1,710

$19.270

$14.610

$13.500

$12.800

Mouser Electronics

USA . 349 parts In-Stock

1+ parts

$19.270

100+ parts

$16.070

1k+ parts

$16.070

10k+ parts

$16.070

349

$19.270

$16.070

$16.070

$16.070

DigiKey

USA . 85 parts In-Stock

1+ parts

$19.270

100+ parts

$15.525

1k+ parts

$15.525

10k+ parts

$15.525

85

$19.270

$15.525

$15.525

$15.525

Newark

USA . 13 parts In-Stock

1+ parts

$19.270

100+ parts

$15.800

1k+ parts

$15.530

10k+ parts

-

13

$19.270

$15.800

$15.530

-

Element14

Singapore . 31 parts In-Stock

1+ parts

$28.130

100+ parts

$22.210

1k+ parts

-

10k+ parts

-

31

$28.130

$22.210

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,583 parts In-Stock

1+ parts

$53.956

100+ parts

-

1k+ parts

-

10k+ parts

-

1,583

$53.956

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

RGB Technical Solutions

Ukraine . 977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

977

-

-

-

-

Technical Specifications

Serial Communication Controllers LAN9255-I/ZMX020 attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

MMC; SD; QSPI; USB

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of I/O Lines:

51

No. of Serial I/Os:

12

No. of Terminals:

128

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Words:

262144

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LAN9255-I/ZMX020 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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