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LAN8700-AEZG

Microchip Technology

LAN8700-AEZG by Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$4.212

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

J2 Sourcing AB

Sweden . 1,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,675

-

-

-

-

Bristol Electronics

USA . 274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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274

-

-

-

-

Rebound Electronics

UK . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Prism Electronics

USA . 42 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42

-

-

-

-

Sensible Micro Corp

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$4.212

1k+ parts

$3.888

10k+ parts

-

29

-

$4.212

$3.888

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Fulton Briggs Corp.

USA . 7,682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,682

-

-

-

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Assy Fe

Spain . 105 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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105

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Technical Specifications

Serial Communication Controllers LAN8700-AEZG attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

25 MHz

Data Encoding or Decoding Method:

NRZI; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

LAN8700-AEZG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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