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DSPIC33FJ32GP202-I/MM

Microchip Technology

DSPIC33FJ32GP202-I/MM by Microchip Technology

DSPIC33FJ32GP202-I/MM by Microchip is a 16-bit DSP with max clock freq of 40 MHz, operating temp range -40 to 85 °C. It's used in industrial applications as a digital signal processor and controller, featuring flash ROM programmability and a supply voltage of 3.3 V.

Median Price

$5.120

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 414 parts In-Stock

1+ parts

$5.120

100+ parts

$4.250

1k+ parts

$3.900

10k+ parts

$3.720

414

$5.120

$4.250

$3.900

$3.720

DigiKey

USA . 390 parts In-Stock

1+ parts

$5.120

100+ parts

$4.250

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-

10k+ parts

-

390

$5.120

$4.250

-

-

Mouser Electronics

USA . 166 parts In-Stock

1+ parts

$5.120

100+ parts

$4.250

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-

10k+ parts

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166

$5.120

$4.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.430

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-

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10

$4.430

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Vyrian

USA . 2,292 parts In-Stock

1+ parts

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2,292

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ComSIT Distribution GmbH

Germany . 59 parts In-Stock

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59

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ComSIT USA

USA . 59 parts In-Stock

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59

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,373 parts In-Stock

1+ parts

$1.693

100+ parts

-

1k+ parts

$1.625

10k+ parts

$1.625

3,373

$1.693

-

$1.625

$1.625

Ampacity Inc.

Singapore . 1,205 parts In-Stock

1+ parts

$4.120

100+ parts

-

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1,205

$4.120

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Netroflash

USA . 500 parts In-Stock

1+ parts

$4.430

100+ parts

-

1k+ parts

$4.208

10k+ parts

$4.120

500

$4.430

-

$4.208

$4.120

Lixinc

USA . 8,709 parts In-Stock

1+ parts

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8,709

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QUARKTWIN TECHNOLOGY LTD

USA . 6,224 parts In-Stock

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6,224

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RGB Technical Solutions

Ukraine . 1,082 parts In-Stock

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1,082

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

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Overview

Unleash the power of digital signal processing with the DSPIC33FJ32GP202-I/MM by Microchip Technology. This cutting-edge product is designed to revolutionize industries with its high-quality performance and reliability. Whether you're looking to enhance your control systems, audio processing, or communication devices, this digital signal processor offers unparalleled value and benefits. Experience faster processing speeds, improved efficiency, and increased functionality with the DSPIC33FJ32GP202-I/MM. Trust in Microchip Technology to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, making the product durable and reliable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, increasing versatility and compatibility with different systems.

Bit Size: 16

Offers high resolution processing capabilities, suitable for complex signal processing tasks.

Maximum Clock Frequency: 40 MHz

Enables fast data processing and response times, crucial for real-time applications.

ROM Programmability: FLASH

Allows for easy reprogramming of the device, enabling flexibility for software updates and customization.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ32GP202-I/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33FJ32GP202-I/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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