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ATSAMD21E16L-MF

Microchip Technology

ATSAMD21E16L-MF by Microchip Technology

ATSAMD21E16L-MF by Microchip: 32-bit Cortex-M0 CPU, 3.63V max supply voltage, 125°C max temp. Ideal for automotive applications with ADC/DAC channels, low power mode, and 26 I/O lines for versatile connectivity.

Median Price

$2.559

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 49 parts In-Stock

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Vyrian

USA . 4,136 parts In-Stock

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VNN

France . 3,125 parts In-Stock

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Argo Parts USA

USA . 3,126 parts In-Stock

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$2.559

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,183 parts In-Stock

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$2.508

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Semicontronic

India . 941 parts In-Stock

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$10.000

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$9.750

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$9.700

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941

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AZTECH Wire

Italy . 775 parts In-Stock

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$10.740

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Ampacity Inc.

Singapore . 1,401 parts In-Stock

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$24.000

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Aztec Data Supply Inc.

USA . 3,336 parts In-Stock

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$57.920

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Corohmni

South Africa . 205 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$67.820

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Fulton Briggs Corp.

USA . 264 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology ATSAMD21E16L-MF microcontroller. With integrated cache, DAC channels, and a maximum clock frequency of 32 MHz, this device is perfect for a wide range of applications. Whether you're working on automotive projects, IoT devices, or industrial automation, this Cortex-M0 CPU family microcontroller offers unmatched performance and reliability. Trust in the quality and expertise of Microchip Technology to bring your designs to life. Elevate your projects with the ATSAMD21E16L-MF and experience the difference today.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps in improving overall performance by reducing the latency for accessing frequently used data.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for flexibility in power supply options and supports a wide range of applications.

CPU Family: CORTEX-M0

Being part of the CORTEX-M0 family ensures compatibility with other devices and a well-established ecosystem for support and development.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and input devices, making it suitable for a variety of applications.

Maximum Clock Frequency: 32 MHz

With a high maximum clock frequency, this microcontroller can handle tasks that require quick processing and response times.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient processing and reduced power consumption, making it a suitable choice for low-power applications.

Analog To Digital Convertors: 10-Ch 12-Bit

Having multiple ADC channels with a high resolution of 12-bit allows for accurate and precise analog to digital conversions, making it ideal for sensor applications.

Technical Specifications

Microcontrollers ATSAMD21E16L-MF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

26

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Current:

1.83 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(6), I2S, LIN(6), SPI(6), USART(6)

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

ATSAMD21E16L-MF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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