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ATSAMD21E16L-AF

Microchip Technology

ATSAMD21E16L-AF by Microchip Technology

ATSAMD21E16L-AF by Microchip: 32-bit Cortex-M0 CPU, 3.63V max supply voltage, 125°C max temp. Ideal for automotive applications with ADC/DAC channels, DMA support, and low power mode.

Median Price

$2.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 403 parts In-Stock

1+ parts

$2.900

100+ parts

$2.400

1k+ parts

$2.380

10k+ parts

-

403

$2.900

$2.400

$2.380

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.619

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10

$2.619

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Vyrian

USA . 2,125 parts In-Stock

1+ parts

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2,125

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VNN

France . 176 parts In-Stock

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176

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Distributors (Availability)

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Vigor

Singapore . 3,651 parts In-Stock

1+ parts

$2.040

100+ parts

-

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3,651

$2.040

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Ampacity Inc.

Singapore . 2,546 parts In-Stock

1+ parts

$2.460

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2,546

$2.460

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Semicontronic

India . 2,395 parts In-Stock

1+ parts

$2.460

100+ parts

$2.398

1k+ parts

$2.386

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-

2,395

$2.460

$2.398

$2.386

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$2.566

100+ parts

-

1k+ parts

$2.464

10k+ parts

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2,000

$2.566

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$2.464

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Continental Prestige Electronics

USA . 1,009 parts In-Stock

1+ parts

$2.619

100+ parts

-

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$2.566

1,009

$2.619

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$2.566

Argo Parts USA

USA . 175 parts In-Stock

1+ parts

$2.619

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175

$2.619

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Corohmni

South Africa . 243 parts In-Stock

1+ parts

$20.306

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243

$20.306

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Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$39.344

100+ parts

$37.377

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$37.377

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59

$39.344

$37.377

$37.377

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Aztec Data Supply Inc.

USA . 4,211 parts In-Stock

1+ parts

$65.180

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4,211

$65.180

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Fulton Briggs Corp.

USA . 6,131 parts In-Stock

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6,131

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the unparalleled quality of the ATSAMD21E16L-AF microcontroller by Microchip Technology, a leading manufacturer in the industry. This versatile device is perfect for a wide range of applications, offering incredible value and benefits to customers. With advanced features like integrated cache, multiple ADC channels, and low power mode, this product provides efficient performance and reliability. Elevate your projects with the cutting-edge technology of the ATSAMD21E16L-AF and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

Integrated cache improves data access speeds and overall performance of the microcontroller.

Maximum Supply Voltage: 3.63 V

Allows for flexibility in power supply options while ensuring stable operation.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

Square package shape helps in easy placement and mounting of the microcontroller on PCBs.

Bit Size: 32

32-bit architecture enables higher processing capabilities and performance.

ADC Channels: YES

Presence of ADC channels allows the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory without CPU intervention.

Maximum Clock Frequency: 32 MHz

High clock frequency facilitates fast data processing and response times of the microcontroller.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple ADC channels with 12-bit resolution provide accurate conversion of analog signals to digital data.

Technical Specifications

Microcontrollers ATSAMD21E16L-AF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

26

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

48 rpm

Maximum Supply Current:

1.83 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(6), I2S, LIN(6), SPI(6), USART(6)

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

ATSAMD21E16L-AF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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