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ATA5577M3330C-DDB

Microchip Technology

ATA5577M3330C-DDB by Microchip Technology

ATA5577M3330C-DDB by Microchip is an industrial-grade telecom IC with 2 terminals. It operates b/w -40 to 85°C, with a compact size of 1x1.35mm. Ideal for telecom circuits, it has a terminal pitch of 0.524mm and is commonly used in various communication applications.

Median Price

$0.435

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$0.435

100+ parts

-

1k+ parts

-

10k+ parts

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54

$0.435

-

-

-

Vyrian

USA . 6,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,016

-

-

-

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VNN

France . 1,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,851

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$0.435

100+ parts

$0.413

1k+ parts

$0.393

10k+ parts

$0.387

120

$0.435

$0.413

$0.393

$0.387

AZTECH Wire

Italy . 549 parts In-Stock

1+ parts

$13.225

100+ parts

-

1k+ parts

-

10k+ parts

-

549

$13.225

-

-

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Ampacity Inc.

Singapore . 1,051 parts In-Stock

1+ parts

$605.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

$605.000

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-

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Lixinc

USA . 11,920 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,920

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XL Components Corporation

Australia . 6,044 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,044

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-

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QualityLine Systems

Poland . 2,251 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,251

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Marpe Global Electronics

Taiwan . 1,199 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,199

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,000

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Overview

Unlock a world of possibilities with the ATA5577M3330C-DDB by Microchip Technology. Known for its superior quality and reliability, Microchip Technology offers innovative solutions that exceed industry standards. This versatile telecom interface IC is perfect for a wide range of applications, providing seamless communication and connectivity. Experience unparalleled value and performance with the ATA5577M3330C-DDB, designed to enhance your projects and elevate your business to new heights.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces chances of errors.

Package Style (Meter): UNCASED CHIP

The uncased chip style offers flexibility in mounting options and saves space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in extreme cold conditions.

Terminal Position: UPPER

The upper terminal position facilitates easier access during installation.

Maximum Seated Height: 0.162 mm

The low seated height enables compact designs and minimizes space requirements.

Width: 1 mm

The slim width makes this product suitable for applications where space is limited.

Length: 1.35 mm

The compact length of the product allows for integration into small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures high reliability and performance in harsh industrial environments.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in telecommunication systems.

Terminal Pitch: 0.524 mm

The small terminal pitch allows for high-density mounting, ideal for applications where space is a constraint.

Technical Specifications

Other Function Telecom Interface ICs ATA5577M3330C-DDB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XUUC-N2

Length:

1.35 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Seated Height:

.162 mm

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.524 mm

Terminal Position:

UPPER

Width:

1 mm

Trade Compliance

ATA5577M3330C-DDB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8523.59.00.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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