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AT26DF041-SU

Microchip Technology

AT26DF041-SU by Microchip Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: SPI;

Median Price

$2.686

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 40 parts In-Stock

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$2.686

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40

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Electronic Expediters

USA . 1,805 parts In-Stock

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Digiode

USA . 902 parts In-Stock

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Prism Electronics

USA . 440 parts In-Stock

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R&J Components

USA . 285 parts In-Stock

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Halfin

Belgium . 206 parts In-Stock

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Cyclops Electronics Ltd

UK . 98 parts In-Stock

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Vyrian

USA . 74 parts In-Stock

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Andel Nordic

Denmark . 1,953 parts In-Stock

1+ parts

$0.090

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-

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$0.061

10k+ parts

$0.061

1,953

$0.090

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$0.061

A-Z Elektronik GmbH

Germany . 7,080 parts In-Stock

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RGB Technical Solutions

Ukraine . 5,404 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,720 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Kepictronics

USA . 2,241 parts In-Stock

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Assy Fe

Spain . 2,217 parts In-Stock

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Supply Digital

USA . 2,008 parts In-Stock

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Corphita

USA . 166 parts In-Stock

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Technical Specifications

Flash Memory AT26DF041-SU attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Additional Features:

ORGANISED AS 2048 PAGES OF 256 BYTES EACH

Maximum Clock Frequency (fCLK):

33 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.29 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.24 mm

Write Protection:

HARDWARE

Trade Compliance

AT26DF041-SU Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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