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A3P1000-FGG484M

Microchip Technology

A3P1000-FGG484M by Microchip Technology

A3P1000-FGG484M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. It operates b/w -55 to 125 °C, has 300 inputs/outputs, and uses a plastic/epoxy package. Ideal for applications requiring high gate count and programmable ICs in compact form factors.

Median Price

$277.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

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$277.990

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Vyrian

USA . 6,164 parts In-Stock

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VNN

France . 2,194 parts In-Stock

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Digiode

USA . 476 parts In-Stock

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AZTECH Wire

Italy . 807 parts In-Stock

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$7.852

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807

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Semicontronic

India . 223 parts In-Stock

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$8.000

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$7.800

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$7.760

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223

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$7.760

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Ampacity Inc.

Singapore . 709 parts In-Stock

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$15.000

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709

$15.000

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Aztec Data Supply Inc.

USA . 1,212 parts In-Stock

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$26.100

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Microchip USA

USA . 2,577 parts In-Stock

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$215.570

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$214.890

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$214.550

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$214.210

2,577

$215.570

$214.890

$214.550

$214.210

Corohmni

South Africa . 661 parts In-Stock

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$264.760

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Continental Prestige Electronics

USA . 3,797 parts In-Stock

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Vigor

Singapore . 64,130 parts In-Stock

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Montano Global Distributors

Canada . 7,588 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,544 parts In-Stock

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LMD Electronica

Estonia . 6,114 parts In-Stock

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NIA Electronics

USA . 4,550 parts In-Stock

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Argo Parts USA

USA . 3,449 parts In-Stock

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Ledger Components

France . 2,289 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$272.430

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$264.090

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$258.531

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$264.090

$258.531

Kepictronics

USA . 620 parts In-Stock

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Corphita

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Overview

Unlock limitless possibilities with the A3P1000-FGG484M by Microchip Technology. This cutting-edge Field Programmable Gate Array boasts 1000000 equivalent gates and 24576 logic cells, making it a powerhouse for a variety of applications. With a package body material of PLASTIC/EPOXY and a maximum supply voltage of 1.575 V, this FPGA is not only versatile but also reliable. Whether you're in the automotive, industrial, or telecommunications industry, this product offers unmatched value and performance. Upgrade to the A3P1000-FGG484M and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this FPGA lightweight and durable, making it easier to handle and more resistant to damage during installation and operation.

No. of Logic Cells: 24576

With a high number of logic cells, this FPGA can handle complex logic operations and processing tasks effectively, making it suitable for demanding applications that require high computational power.

Maximum Supply Voltage: 1.575 V

The FPGA can operate at a relatively high maximum supply voltage of 1.575 V, providing flexibility in power supply options and ensuring stable performance at different voltage levels.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making this FPGA efficient and reliable for a wide range of applications.

No. of Inputs: 300

With a large number of inputs, this FPGA can interface with multiple external devices and sensors, enabling versatile connectivity and data processing capabilities in complex systems.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and ensures easy integration with other components, making this FPGA ideal for compact designs and space-constrained environments.

No. of Equivalent Gates: 1000000

Having a high number of equivalent gates means this FPGA can handle large and complex digital designs, providing ample resources for implementing advanced functionalities and processing algorithms.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage of 1.5 V offers a standard operating voltage for the FPGA, ensuring compatibility with common power sources and simplifying the design of power delivery circuits.

No. of Terminals: 484

With a large number of terminals, this FPGA allows for versatile connectivity options and simplifies the integration of external components, enabling customization and scalability in system design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this device offers flexibility in reconfiguring logic functions and adapting to changing application requirements without the need for physical modifications, making it versatile and cost-effective.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A3P1000-FGG484M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

24576

No. of Inputs:

300

No. of Outputs:

300

No. of Equivalent Gates:

1000000

Technology:

CMOS

Organization:

1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

A3P1000-FGG484M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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